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Amphenol

RADSOK® Power to Board

Amphenol Industrial Global Operations introduces the RADSOK® R4 high-current contact system, the next generation of the proven RADSOK® line of power connectors. The laser-welded construction of the R4 contact delivers the same performance as the original RADSOK® contact in a smaller package that is optimized for high volume manufacturing. RADSOK® connectors are available for board-to-board, wire-to-board and busbar-to-board configurations.

Ideal for use by both server and board manufacturers, RADSOK R4 delivers connections up to 200A. The hyperbolic grid contact provides more surface area with many points of contact for heat dissipation at the pin and socket interface. This lowers temperature rise and reduces potential failures. RADSOCK® Power-to-Board products are designed to be applied manually by press-fit or by a re-flow solder process eliminating the need for additional wires and/or special crimp tools.

RADSOK R4 features a lower temperature rise than other traditional contact systems in its class, enabling smaller overall connector packaging and compact footprints. With a 25% reduction in outside diameter over previous models, the new R4 helps to further increase power density and save space.

Amphenol’s RADSOK R4 is easily configured to specific application requirements. The versatile RADSOK contact can be efficiently adapted to custom packaging with minimal non-recurring engineering costs. The proven RADSOK radial contact design offers superior mechanical and electrical performance for high current board termination. The system offers more consistent performance as well as lower voltage drop and contact resistance.

For enhanced radial float tolerance in applications that require blind mate or mechanical robustness, RADSOK Super Twist R4 contacts are available.

RADSOK R4’s laser welded assembly offers better mechanical strength than other contact systems on the market.

The following all use Amphenol’s RADSOK 4 technology:

  • RADSTACK, a high current mezzanine board stacking system;
  • RADFIN, a low profile, right angle receptacle; sizes up to 200A
  • PowerBlok, a connector that provides a high current single-point connection of up to 150A to the PCB utilizing the RADSOK Super Twist contact system;
  • RADSERT, contacts that provides a high power-to-board interconnect;
  • PGY, an orthogonal connector series available in multiples sizes from 35A to 150A



RADSOK-PowerBlok
RADSOK® PowerBlok™ provides a high current single-point connection of up to 70 Amps to the PCB utilizing our custom 3.0mm RADSOK ® design. The compliant pins are press-fit into the board to secure a solid connection and even current flow. The radial design ensures many points of contact, reduces failure modes, and eliminates burnouts and possible stress fractures. Features Include:
  • High power to board interconnect in a small package
  • Compact footprint 15.7mm x 15.7mm
  • RADSOK® 2.4mm, 3.0mm & 3.6mm (35A-60A-70A)
  • Backplane power interface with compliant pins for power
  • Touchproof cover
  • Hyperbolic socket design ensures many points of contact
  • Reduces failure modes, eliminates burn outs
  • No threaded fasteners
  • No special crimp tools required
  • Eliminates possible stress fractures in board
  • Faster through-put
  • RoHS compliant



RADSOK RadSert
RADSOK® RADSERT™ provides high power to board interconnect in a small package. The RADSERT™ brings power to the board from busbars suspended above the board and all of the board components. Pins from the busbar plug into the RADSOK’s® which are installed by press fitting the RADSOK® into the RADSERT™. Features Include:
  • High power to board interconnect in a small package
  • Hyperbolic socket design ensures many points of contact
  • Solder version or pre-loaded RADSERTS are installed during board fabrication
  • RADSERT™ 2.4mm (35A), 3.0mm (60A), 3.6mm (70A) 4.8mm (100A) & 6.0mm (120A)
  • No special crimp tools required
  • No threaded fasteners
  • Eliminates risk of PTH cracking or delamination in board
  • Faster through-put
  • RoHS compliant



Radsok-PGY
RADSOK® PGY™ is a right angle, co-planar or orthogonal card edge connector series available in 2.4mm, 3.6mm and 5.7mm contact sizes. The 5.7mm is the highest current board level product rated to 120 amperes. Connection to the board is through a solder reflow process. The busbar pin will mate horizontally with the RADSOK® slightly above the board. Features Include:
  • Orthogonal, co-planar & right angle connections between PCBs or PCB to bus bar
  • Compact footprint
  • Legs of the PGY distribute high power evenly
  • 2.4mm carries up to 35 Amps
  • 3.0mm carries up to 60 Amps
  • 3.6mm carries up to 70 Amps
  • 4.8mm carries up to 100 Amps
  • 5.7mm carries up to 120 Amps
  • No threaded fasteners
  • No special crimp tools required
  • Faster through-put
  • RoHS compliant



Radsok Radstack
RADSOK® RadStack™ was designed to address the need for high current and small foot prints for PCB mezzanine applications. The RadStack™ is low-profile, 10mm to 50mm in any size increment using press fit attachment with a current range of 35A to 120A. Features Include:
  • Mezzanine connection between parallel PCBs
  • Compact footprint
  • Low-profile, 10mm to 50mm in any size increment
  • 2.4mm carries up to 35 Amps
  • 3.0mm carries up to 60 Amps
  • 3.6mm carries up to 70 Amps
  • 4.8mm carries up to 100 Amps
  • 5.7mm carries up to 120 Amps
  • Pressfit
  • Faster through-put
  • RoHS compliant

See also:
RADSOK Power to Board (.pdf) for more product information, specifications, applications and ordering information.


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