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3mm Board-to-Board Interconnect

Amphenol SV Microwave just launched a line of 3mm coaxial between board spacing PCB interconnects. This line allows for the lowest stacked height (3mm) of any board-to-board high frequency coaxial connection system. Amphenol's 3mm product line is ideal for high density stacked and high density multiport applications. Additionally, installation of this line can be accomplished with and without solder.Amphenol SV Microwave 3mm Board-to-Board Interconnect

Features:

  • 3mm board-to-board spacing
  • .150” minimum pitch between adjacent connectors
  • DC - 40 GHz
  • Low-force, solderless installation does not damage PCB
  • Easy to assemble, solderless design reduces yield and assembly time
  • Lowest stacked height (3 mm) of any board-to-board high frequency coaxial connection system

Industries:

  • Computer
  • Datacom
  • Telecommunications

Applications:

  • Embedded computing
  • High density stacked PCB applications
  • High density multiport applications

Part Number View Inventory
012-80-484/185 3MM MALE THREAD-IN SHROUD, SB
012-80-485/185 3MM MALE THREAD-IN SHROUD, FD
012-80-487/020 3MM MALE SOLDER-ON SHROUD, SB
012-80-488/020 3MM MALE SOLDER-ON SHROUD, FD
1180-4009 3MM FEMALE TO FEMALE BULLET
500-80-014 3MM BULLET REMOVAL TOOL

See also:
Amphenol SV Microwave 3mm Board-to-Board Interconnect(.pdf) for more product information, specifications, applications and ordering information.

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