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AirMax VS® Connector Systems Enables CompactPCI® Serial Specification

AirMax VS® high speed signal connectors meet the dimensional and electrical requirements described in the CompactPCI® Serial (PICMG CPCI-S.0) Specification. Connections between a front system or peripheral board and the backplane are accomplished using right-angle headers and vertical receptacles. The interface to a rear I/O board uses right-angle receptacles and vertical headers. The open pin field design of AirMax VS signal connectors provides flexibility to use pins for differential or single-ended signals, ground or power.

The CompactPCI Serial Specification moves CompactPCI architecture to high-speed serial interconnects to add greater support for serial point to point fabrics like PCI Express®, SATA, Ethernet and USB in the classic CompactPCI form factor with mechanics fully compliant to IEC 1101. The specification contains definitions for both system and peripheral slots in 3U and 6U board sizes. The specification allows hybrid systems integrating legacy CompactPCI boards and newer CompactPCI Serial boards to simplify the migration to serial interconnect technologies.

The AirMax VS system uses FCI technologies for shield-less design with no metallic plates and closely coupled differential pairs deliver low loss and crosstalk. The capability to scale differential signals to 12.5 Gb/s with the AirMax VS system also provides headroom to support future increases in data rates without requiring changes to the connector interface.

Part Number View Inventory
10114633 Rear Daughter Card Connectors (Right-Angle Receptacles)
1011476 Midplane Rear Side Connectors (Vertical Headers)


  • Industrial computing and storage systems
  • Industrial automation, control and monitoring equipment
  • Data acquisition equipment
  • Instrumentation
  • Simulation and test equipment
  • Surveillance systems
  • Medical equipment
  • High speed / high bandwidth data communication applications

See also:
AirMax VS® Connector Systems (.pdf) for more product information, specifications, applications and ordering information.

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