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FCI's New Densi-Shield I/O Connector Increases Board Edge Density And Signal Integrity

Designed to simplify PCB assembly and meet the stringent demands of rack-mounted telecommunications equipment, FCI introduced its Densi-Shield I/O™ connector system. Creating front I/O connections for 15mm card pitch and supporting transmission speeds up to 2.5Gbps and beyond with or without signal conditioning. Densi-Shield I/O provides reliable high-speed interconnections between plug-in units stacked within the same rack or adjacent racks and cabinets. The connector's shorter cable exit length helps avoid contact with the cabinet door.

"The Densi-Shield I/O connector was developed for the ease-of-use and to provide the high performance required in telecom applications," said Pat DiPaola, FCI Regional Market Manager. "The one-piece, shielded board-mount connector assembly allows automatic component insertion while its pin-in-paste-compatible signal and ground pins meet the requirements of standard and lead-free surface mount solder processes."

Densi-Shield I/O connectors utilize shielded plastic wafers carrying two signal pairs separated by an optional ground pin, with four wafers providing eight pairs, or four bi-directional channels per connector assembly. This provides modularity in that other connector pin counts are readily achieved. Torx head, hexagonal or thumbscrew locking options are available to secure the shielded cable connector to the right-angle system connector.

A double ferrule crimp system and rugged back shell ensure continuity in EMI protection and provide enhanced cable strain relief. High levels of EMI protection are achieved, and the board connector's overall metal housing features all-around surface mount pads for direct PCB soldering. Spring tabs ensure grounding with both panel cut-out and cable connector, and the signal ground path is isolated from EMC ground.

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