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FCI Expands GIG-Array® High-Speed Mezzanine Connector Family With Additional Stack Heights

ETTERS, PA (September 17, 2005) – FCI, a leading manufacturer of connectors and interconnect systems, expands its GIG-Array® high-speed, high-density mezzanine product line with the addition of new connector configurations that provide 200 signal contacts at 15mm, 20mm, 25mm, 30mm, or 35mm board spacing.

"With the addition of these new GIG-Array connector options, we're offering system designers even greater flexibility," said Grace Showers, FCI Global Product Manager. "Both our 200-position and 296-position connector sizes are now available at seven stack heights: 15mm, 18mm, 20mm, 25mm, 28mm, 30mm, and 35mm. "

The GIG-Array line is designed for 100-Ohm matched impedance to support differential signaling at data rates of 10Gb/s with very low crosstalk to preserve signal integrity. The connector family is effective for high-speed board–stacking applications in server, storage, transmission, switching, and networking equipment.

The 200-position connector contains 25 columns with eight individual signal contacts and 10 ground contacts in each column for a total of 200 signal and 250 ground contacts. The use of individual contacts for both signal and ground connections provides more flexibility in handling power or low-speed, single-ended signals than systems that utilize interleaving ground shields.

All GIG-Array connectors feature FCI's innovative Ball Grid Array (BGA) connector termination for easy attachment to printed circuit boards using conventional reflow soldering processes. The 1mm x 0.65mm ball grid optimizes routing and electrical performance.

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