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FCI's LGA775 Processor Socket Enables PCI Express® Signaling

ETTERS, PA (March 14, 2006) - FCI has developed a lead-free, 775-position LGA775 Processor Socket to enable the use of microprocessors that support PCI Express signaling in desktop PCs. Utilizing FCI’s patented BGA (Ball Grid Array) technology for motherboard attachment and an LGA (Land Grid Array) interface to the microprocessor, the LGA775 Processor socket performs as a low inductance device (<4 nH) with <1pF capacitance pin-to-pin to optimize the processor’s high-speed electrical performance. A low normal force contact with wiping action produces consistent and reliable electrical performance.

A pre-installed pickup cover facilitates placement using conventional pick-and-place equipment while the use of BGA termination technology allows the socket assembly to self-center on the PCB pads as well as self-level in the z-axis direction. An integrated lever system actuates the socket when the chip has been seated properly. BGA technology also reduces cost of assembly in contract manufacturing.

“Our LGA775 socket is RoHS-compliant and compatible with lead-free processing temperatures,” says Scott Kleinle, FCI Global Data Market Manager. “The socket has successfully met all qualifications required for use with industry leading processor chips.”

FCI also produces associated products such as SATA, ExpressCard, PCI Express Card Edge, DDRII memory sockets, and other standards-based connectors that are used in conjunction with the LGA775 Processor Socket.

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