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Mill-Max

Mill-Max

MILL-MAX Adds 2 New Receptacles With Organic Fibre Plug® Solder Barrier – 10 Sizes Now Available; 8 On Tape

Mill-Max’s knock-out-bottom receptacles are discrete sockets for soldering into printed circuit boards.

Ten sizes are now available; eight have carrier tape as standard packaging. Tape packaging is becoming increasingly popular since it permits thru-hole components to be placed simultaneously with surface mount parts on pick-’n-place assembly lines. The knock-out-bottom feature enables these sockets to be made short enough to stand upright in a carrier tape pocket. The OFP® barrier then permits the sockets to be vacuum picked from the tape prior to placement in a hole in the circuit board.

FEATURES:

  • Designed for hand, wave or reflow* soldering. The organic fibre plug® barrier prevents solder, paste or flux from contaminating the spring contact.
  • After soldering, the OFP® barrier is knocked out of the receptacle when the device is plugged in.
  • The thru-hole receptacle design permits the component lead to pass through and make connection with another circuit board.
  • All Mill-Max receptacles use a precision machined brass housing with a press-fit beryllium copper “multi-finger” contact (heat-treated BeCu is the best electrical spring contact material).
  • All parts are available as discrete receptacles; #0479, #0577, #4015, #4280, #5280, #5359, #5364 & #9873 can also be supplied on carrier tape per EIA-481 for industry standard pick and place machines.

*Intrusive reflow (also called "pin-in-paste") is a technique of using conventional thru-hole components in a reflow soldering process. The receptacles are placed into plated-thru-holes in the circuit board (solder paste has previously been screen printed on pads adjacent to the holes) and the board is reflowed in the same pass as other SMT components. Solder will fill the plated-thru-holes and achieve solder joints as reliable as wave soldering. The OFP® barrier prevents solder paste from being picked-up inside the contact during pick ‘n place assembly. "Overprinting" paste on the solder mask can be used to adjust the volume of paste required to fill each hole.

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