Molex introduces the "New" DDR4 DIMM Halogen-Free Series. The DDR4 DIMM series provides excellent performance and is available in four socket styles to meet demanding design requirements.
Angled, Ultra Low-profile, Aerodynamic and Standard DDR4 DIMM sockets combine excellent performance with maximum space-savings and assembly processing for high-speed data and networking applications.
Features and benefits include:
25° angle inclination to the horizontal (Angled version) gives up to 45% vertical space savings over standard vertical versions
Ultra-low seating place of 1.10mm (Ultra low-profile version) frees up vertical module space to allow use of high-density DIMMs while maintaining the same design height; enables the use of the very low-profile modules with seating heights below 2.80mm (maximum) in ATCA* blade systems
Lower current of 0.75A per terminal compared to 1.0A for ULP DDR3 DIMM versions for bigger energy cost savings
Streamlined housing and latch design (Aerodynamic series) minimized trapping of hot air around high-density memory modules during operations
Metal-reinforced latch tower housing (Angled, Aerodynamic and Standard series) prevents cleavage or separation of tower bridge due to wear and tear
Multiple soldertail length options available for Through-hole and Press-fit sockets (Aerodynamic and Standard series) to suit various PCB thicknesses
Flush soldertail design for SMT socket (Standard series only) minimizes accidental damage to terminals due to bending
Anti-stubbing mating contacts (All Series), which provide smooth module lead-in and contact grip during insertion