Molex introduces "New" low profile, high durability spring clips that offer smartphone makers maximum cost savings with greater design flexibility and specific loading control.
Benefits include a reinforced anti-snag design that prevents contact damage during assembly processing and yield loss, kinked ribs with a closed tip to prevent solder wicking,1,500 durability cycles deliver sustained high performance, and Device-to-PCB grounding contact which reduces EMI noise and electrostatic discharge.
The dimple is designed with a reduced area which provides higher contact pressure between mated device and spring clip for enhanced contact reliability, also features a pick-and-place area for nozzle pre-load function.
This new Series from Molex is RoHS Compliant, Halogen free and Glow Wire Compliant.
Features and Benefits include:
Wide working range from 0.25 to 1.10mm that offers greater design flexibility with specific loading control
Anti-snag design, which provides contact damage during assembly processing and yield loss
Narrow clip width of 1.00mm that supports small PCB applications
1,500 durability cycles which deliver sustained high performance
Kinked ribs that prevent solder wicking
Device-to-PCD grounding contact, which reduces EMI noise and electrostatic discharge
RF-to-PCB contact that provides greater cost savings when used with non-soldered wire-less devices
Markets and Applications:
Smartphone and Mobile Devices
Digital video recorders
Wireless LAN devices
Set top boxes
Small Office/Home Office switches and routers
Surveillance, security cameras and systems
Kinked Ribs, Closed Tip Spring Clip, 2.00mm Width, 0.40mm - 0.80mm Working Range (Height)
Kinked Ribs, Closed Tip Spring Clip, 2.00mm Width, 0.70mm - 1.10mm Working Range (Height)
Kinked Ribs, Closed Tip Spring Clip, 2.00mm Width, 0.30mm - 0.55mm Working Range (Height)