Press Release
For Immediate Release

GbX* Reference Backplane Demonstrator from Molex
Enables Precise Component Evaluation

As data and telecom systems move to speeds beyond 3 Gbps, design engineers need improved methods for evaluating the components that go into these systems. Molex has responded to this need with a backplane demonstrator intended to help chip and system designers accurately predict how components will perform in actual applications. A model of the Demonstrator Reference Backplane will be on display at DesignCon, Booth 200, Feb. 2-5.

The Molex GbX* reference backplane provides a system level demonstrator that links all active and passive transmission components necessary to evaluate the effective transfer of high-speed multi-channel traffic. Discrete components and the associated interface technology can be demonstrated in a system environment designed to ensure an accurate representation of overall system performance.

The 38” x 13” 20-layer backplane, constructed with two grades of ParkNelco laminates with an overall thickness of 5.7 mm (.225”), is a representation of a real-life application and therefore, simulates a wide range of challenges that designers face. With this backplane, engineers can determine the transmission quality from transmitter to receiver at three standard channel lengths (0.20 meters; 0.63 meters; and 1 meter) and in a variety of standard and non-standard configurations.

The backplane demonstrator also:

• Allows the option of the semiconductor drivers to be directly connected to the backplane through the GbX connectors or driven indirectly through cabled SMA ports
• Features channel routing through pin field
• Includes a second set of co-routed active channels for noise and density assessments
• Provides a wide range of interface launch technologies to optimize GbX performance.

In developing the demonstrator, the Molex team addressed issues voiced by members of the Optical Internetworking Forum (OIF). “We wanted to make sure that our backplane was going to fully meet the needs of the design community,” said Dave Brunker, Technical Fellow for Molex Incorporated.

In comparing the Molex backplane demonstrator to other backplane demonstrators available today, Dave says that Molex has incorporated new features that upgrade its demonstrator into a technology kit for high-speed communications. There is enough diversity provided in a menu fashion to allow designers to replicate actual system solutions in operation.

The backplanes and daughter cards will be available for sale from Molex at the end of March 2004. Molex will also have daughtercard reference designs available.

*GbX is a trademark of Teradyne, Inc.

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