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Press Release
For Immediate Release

 

Ten Industry Leaders Announce Release of
IBPAK Multi-Source Agreement Specification
for Hot-Swap Capable Transceivers Supporting InfiniBand*

New Multi-Source Agreement to Create Common Product Specification for Components Supporting InfiniBand-Defined 4X Copper Cable Ports and 4X/12X Fiber Optic Ports

LISLE, Ill. – March 3, 2004 – Agilent Technologies Inc., Infineon Technologies, InfiniCon Systems, Mindspeed Technologies, Molex Incorporated (NASDAQ: MOLX and MOLXA), Optical Communication Products, Picolight Inc., Sun Microsystems, Inc., Tyco Electronics and W. L. Gore & Associates Inc. today announced the public release of the IBPAK multi-source agreement specification. This provides the common specification for hot-pluggable 4X copper transceivers and 4X/12X fiber optic transceivers that support InfiniBand defined ports. IBPAK enables multiple compatible sources of front-panel, hot-swap capable, 10Gb/s (4 lane) and 30 Gb/s (12 lane) transceivers, including the electrical host connector and guide rail. 12X copper transceiver solutions are not precluded ad may be added later based on market activity.

The IBPAK specification incorporates the high-speed electrical, copper cable and fiber attachment requirements defined in InfiniBand Architecture Specification Volume 2, Release 1.1, and adds the necessary definition for the electrical connector, package outline, guide rail, hot-swap (hot-pluggable), test and control features to enable compatible and interchangeable solutions for 4X copper cable ports and 4X/12X fiber optic ports. Transceivers based on this MSA are expected to function as transparent, re-timing repeaters, providing robust board-to-board and inter-chassis interconnections enabling fabric linking equipment within data centers among InfiniBand servers or between servers and storage equipment.

The IBPAK specification also identifies common product specifications for the host PCB layout, front panel requirements, EMI seal, electrical and management interfaces, and thermal, EMI and ESD requirements. IBPAK transceivers are expected to provide signal conditioning, vendor and product information, status reports and control via a serial interface.

Now that the details of the specification have been made available to the industry, other transceiver and component manufacturers can produce compatible products. IBPAK optical module companies expect to begin shipping these new transceivers next year. Guide rails and host board connectors are available for developers.

More information on the MSA and status and availability of the specification is available at www.IBPAK.org.

*InfiniBand(TM/SM) is a trademark and service mark of the InfiniBand Trade Association. Other names and brands are the property of their respective owners.

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