One Company, a World of Innovation. Molex, the world's second-largest manufacturer of connectors, is a leader in interconnect technology currently offering over 100,000 products supporting the full range of electronics markets including: medical electronics, automotive, non-automotive transportation, industrial controls and datacom.
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Mini-Fit® Overmolded Cable Assemblies - Molex's Mini-Fit® Overmolded Cable Assemblies with strain relief are available in multiple circuit sizes and cable lengths for a rugged signal connection. These cable assemblies are designed to meet the need for a high contact-density wire-to-board connector for signal or power applications.
Cellular 790 to 2700 MHz Antennas - Molex's Cellular 790 to 2700 MHz antenna product line provides extended cellular bands spanning 698 to 2700 MHz for IoT applications. Fixing pads firmly anchor the antenna housing onto the SMT pads of the PCB while the grounding pad ensures the antenna is safely grounded on the applications PCB.
Micro-Fit* Overmolded Cable Assemblies - Molex's Micro-Fit* Double-Ended, Overmolded Cable Assemblies with strain relief are available in multiple circuit sizes and cable lengths for a rugged signal connection. The cable assemblies are capable of carrying 5.0 A of current, which makes them ideal for many signal and power applications.
Ultra-Fit™ Cable Assemblies - Molex's standard Ultra-Fit™ Cable Assemblies deliver an off-the-shelf solution with a variety of cable lengths and a high-density, compact connector to facilitate both prototyping and global production. These cable assemblies also eliminate same-circuit-size cross mating while optimizing space savings and reducing terminal back out with low mating force.
Extractor Tool for CTX-J 100 Receptacle Crimp Terminal - This extractor tool is for the removal of a CTX-J 100 receptacle crimp terminal from a Compactus connector.
Nano-Fit Power Connectors - Molex Nano-Fit™ 2.5mm Power Connectors are fully isolated power connectors with fully isolated terminals in a compact size. Engineers are, therefore, provided with a space-saving solution to the design challenge of choosing between exposed terminals or space-greedy protected headers.
CP-3.3 Wire-to-Wire Connector System - Molex's CP-3.3 Wire-to-Wire Connector System leverages full keying and color-pairing features to enhance user-safety while preventing moisture seepage in consumer electronics, white goods, industrial and medical applications.
Tri-Band Wifi Antenna - Molex's Tri Band Wi-Fi Ceramic Antenna offers greater power efficiency and longer-range connectivity to Wi-Fi Certified products, triple-band ceramic antenna enables multi-vendor operability and easy setup for IoT and M2M applications.
Global Navigation Satellite System (GNSS) Antennas - Eliminating space and PCB real-estate constraints, LDS-MID and Ceramic GNSS/GPS antennas combine ease of integration with reduced cost of implementation over a variety of wireless navigation device applications. A satellite navigation system with global coverage may be termed a global navigation satellite system GNSS.
Pico-Lock™ Discrete Wire Cable Assemblies - Molex's Pico-Lock™ Discrete Wire Cable Assemblies deliver off-the-shelf solutions in a variety of cable lengths to facilitate both prototyping and global production. The Pico-Lock Cable Assemblies offer a low profile, high current, and positive lock making them ideal for applications requiring space savings.
PowerPlane Bus Bar Power Connectors - Molex's PowerPlane Bus Bar Power Connectors deliver high-current performance along with various configurations and feature options, making them applicable for a wide range of power-distribution.
TM-3000/TM-4000 Crimp Press System - Molex's semi-automatic crimping machines provide a versatile production tool for mid- to high- production volumes by utilizing an effective method for applying a wide range of side-feed and rear-feed terminals to a pre-stripped discrete wire or cable.
Rectangular Near Field Communication Antennas - Molex's Rectangular Near Field Communication (NFC) Antennas maximize effectiveness of quick, two-way read/write operations over a wide range of detection distances from metallic and non-metallic substrate applications.
HarshIO EtherNet/IP* IO-Link Modules - Molex's HarshIO EtherNet/IP* IO-Link Modules are designed for factory automation machine builders, bringing versatility and cost savings to complex system design through EtherNet/IP controllers.
EconoLatch® Wire-to-Wire Connectors - Molex's EconoLatch® Wire-to-Wire Connectors support up to 9.0A of current per circuit and allow quick swapping of wired terminals for disruption-free operations in consumer, automotive and industrial applications.
PicoBlade™ Cable Assemblies - Molex PicoBlade™ Cable Assemblies are off-the-shelf cable assemblies that come in a variety of cable lengths in a compact connector to support your design for both prototyping and global production.
New Application Hand Tools - Molex has introduced full cycle ratcheting hand tools that ensure complete crimps for 1.25 mm pitch wire-to-board crimp terminals for 26-30 AWG, UL 1061 wire and for 1.25 mm pitch PicoBlade™ crimp terminals for 26-32 AWG.
Mini-Fit™ TPA Tooling Package - Molex's new Mini-Fit TPA tooling package includes a hand crimp tool, locator assembly, spring return and spring ratchet. The full-cycle ratcheting hand tool ensures complete crimps while the ergonomic soft grip handles allow comfortable crimping.
CLIK-Mate™ Discrete Wire Cable Assemblies - Molex's CLIK-Mate™ Discrete Wire Cable Assemblies carry 2.5A with a 1.50mm pitch while delivering off-the-shelf (OTS) solutions with a broad offering of Molex connectors and a variety of cable lengths to facilitate both prototyping and global production.
Slim-Grid 1.27mm Pitch Board-to-Board Connectors - Molex's Slim-Grid 1.27mm Pitch Board-to-Board Connectors offer a high-current density board-to-board interconnect solution in a 1.27 by 1.27mm-grid pattern.
MicroClasp™ Discrete Wire Cable Assemblies - Molex's MicroClasp™ Discrete Wire Cable Assemblies are capable of carrying a maximum of 3.0A of current with 2.00mm pitch, which provides space savings and easy mating/unmating compared to similar 2.00- and 2.50mm pitch wire-to-board systems.
Nano-Fit™ TPA Discrete Wire Cable Assemblies - Molex's Nano-Fit™ TPA Discrete Wire Cable Assemblies deliver off-the-shelf (OTS) solutions with a broad offering of Molex connectors and have up to a 6.5A current rating in a small package, which brings space savings for design flexibility.
Pico-Clasp™ Discrete Wire Cable Assemblies - Molex's Pico-Clasp™ Discrete Wire Cable Assemblies deliver off-the-shelf (OTS) solutions with a broad offering of Molex connectors and a variety of cable lengths to facilitate both prototyping and global production.
Milli-Grid™ Halogen-free Shrouded Connectors - Molex's Milli-Grid Halogen-free Shrouded Connectors are available in a variety of orientation and mounting configurations and offer robust mating performance while meeting halogen-free requirements in data, consumer and other wire-to-board applications.
Brad® M8 and M12 Cordsets - Brad® M8/M12 cordsets with WSOR cable are designed for a variety of harsh-environment applications, including welding, metalworking and machining processes using cutting-oil. This removes the need for different cabling in specific applications.
EXTreme Ten60Power™ High-Current Connectors - Molex's EXTreme Ten60Power™ High-Current Connectors are designed for board-to-board, wire-to-board and panel-to-board applications and provides up to 260.0A per linear inch, fast response times and easy-to-configure models.
Micro-Fit* TPA Cable Assemblies - Molex's Micro-Fit* TPA Cable Assemblies deliver an off-the-shelf solution with a variety of cable lengths and a 3.00mm-pitch connector with a 5.0A maximum current rating to facilitate both prototyping and global production. These cable assemblies are available in 4, 6, and 8-circuit sizes and in 1, 1.5 and 3m lengths.
iGrid™ Wire-to-Board Dual-Row System - The iGrid™ 2.00mm pitch connector system offers compact design and anti-tangle internal lock for applications requiring good mating retention.
Mini-Fit® TPA 2 Cable Assemblies - Molex's Mini-Fit TPA 2 Cable Assemblies deliver an off-the-shelf solution with a variety of cable lengths and a 4.20mm-pitch connector with a 13.0A maximum current rating to facilitate both prototyping and global production.
MX123™ Sealed Connection System - Designed for transportation power-train applications requiring reliable connections in high-vibration under-the-hood environments. The MX123™ offers a rugged, fully-sealed interface with the smallest packaging size in the industry.
2.4/5 GHz Combo GPS†/Wi-Fi* PCB & Flexible Antennas with Balanced Transmission - Molex Dual-band transmission-balanced antennas combine ground-plane independence with high-radiation efficiency.
Brad® Micro-Change® CAT6A Connector System - Molex's Brad® Micro-Change® CAT6A Connector System delivers next-gen speeds up to 10 Gigabit Ethernet and superior signal integrity through a 360° shielded X-code interface. The connector system is suited for harsh and high-vibration applications.
22.5° Angled and Vertical DDR4 miniDIMM Sockets - Molex's 22.5° Angled and Vertical DDR4 miniDIMM Sockets save nearly half the overhead space of the vertical equivalent in enterprise computing and networking memory applications and offer the highest robust mating and usability features for reliable operations.
ValuSeal™ Wire-to-Wire Connector System - Molex's ValuSeal™ Wire-to-Wire Connector System achieves industry-leading cost efficiencies and IP65 sealing protection. The innovative, one-piece design eliminates failures and issues associated with use of unsealed connector systems in adverse conditions.
Brad® M12 and M8 Field Attachable Connectors - Molex's Brad® M12 and M8 Field Attachable Connectors provide customers a flexible solution to install and adapt their automation infrastructure to the requirements of their complex machines.
Ceramic and LDS-MID GPS† Antennas - Molex's Ceramic and LDS-MID GPS Antennas eliminate space and PCB real-estate constraints and combine the ease of integration with reduced cost of implementation over a variety of wireless navigation device applications.
CLIK-Mate™ Wire-to-Board Connector System - Molex's CLIK-Mate™ Wire-to-Board Connector System comes in pitch sizes of 1.25, 1.50 and 2.00mm and provides a secure electrical contact, low insertion force and mating assurance in a wide variety of configurations, circuit sizes and current options.
Brad® DeviceNet* HarshIO - Molex's Brad® DeviceNet* HarshIO M8 Modules are the only modules that combine IP67 protection, an extremely compact housing and full M8 connectivity. This product also provides protection against dust, water and withstands shock, high-vibration and high temperature.
Fully-Automated Equipment - Molex's Fully-Automatic Equipment improves output levels over semi-automatic tools. The Applicators are designed to provide an effective method of applying a wide range of side- and/or rear-feed terminals to a pre-stripped discrete wire and cable and also adapt to most automatic wire processors.
CMC & CMX Connector Systems - Molex's CMC and CMX connector families are IP6K9K sealed, modular, high-density and hybrid connection systems developed specifically for the transportation industry. The CMC and CMX connectors are designed to perform in high-conductivity applications and harsh environments.
Pre-Crimped Leads - Molex's Pre-Crimped Leads offer a simple and cost-effective solution for any pre-production and prototype requirements. The pre-crimped leads are available for the most popular Molex connector families, offered in female-to-female and male-to-male configurations and lengths of 150mm and 300mm.
Mizu-P25™ Wire-to-Wire Connector System - Molex's Mizu-P25 Wire-to-Wire Connector system is the first miniature sealed system in the market to achieve IP67 certification, which provides superior levels of dustproof and waterproof protection along with space savings.
Temp-Flex® Foam-Core Ultra-Low-Loss Coaxial Microwave Cables - Molex's Temp-Flex® Foam-Core Ultra-Low-Loss Coaxial Microwave Cables combine space savings with an effective dielectric that eliminates "phase knee" and provides ease of termination.
Mini50™ Unsealed Connection System - Molex's Mini50™ Unsealed Connection System delivers 50% space savings over traditional USCAR 0.64mm connectors with smaller terminals to fit more signals into vehicle interiors. This connection system is approved as the industry's only USCAR 050 interface.
Brad® EtherNet/IP* HarshIO Analog Modules - Molex introduces the Brad® EtherNet/IP* HarshIO Analog Modules for Roller Drives which are ideal for many material handling applications and provide an IP67 rated solution for interfacing industrial controllers with conveyor rollers in harsh duty environments.
4.3-10 RF Connector System and Cable Assemblies - Molex's 4.3-10 RF Connector System and Cable Assemblies offers high-performance signal transmission with low passive intermodulation (PIM), 100% data traceability and less torque than current interfaces.
Brad® Safety MPIS Distribution Boxes - Molex's Brad® Passive-Signal and Safety MPIS Boxes achieve quick, easy and reliable connections of high-density industrial signal IOs and simplify wiring in harsh factory-automation environments.
stAK50h™ Infotainment Connector System - Molex's stAK50h™ Infotainment Connector System incorporates unsealed hybrid connectors to deliver both signal and Ethernet connectivity through one low-footprint connector.
Milli-Grid™ Single-Row Connectors - Molex's Milli-Grid™ Single-Row Connectors with Positive Lock make wire-to-wire and wire-to-board signal configurations easy and cost-efficient for data communications, consumer and other applications.
LTE* SMT Cellular Antennas - Molex's LTE* SMT antennas enable higher speed wireless deployments in advancing 4G technology. The new series includes a compact LTE SMT cellular antenna, a multi-band cellular/Wi-Fi Combo Flex antenna with balanced transmission, and a cellular 6-band antenna.
RHCP* & Helix Antennas - Molex introduces the RHCP* and Helix Antennas that eliminate space and PCB real-estate constraints. Molex's antennas combine ease of integration with reduced cost of implementation over a variety of wireless navigation device applications.
Nano-Fit™ Power Connectors - Molex's Nano-Fit™ Power Connectors deliver both fully protected header terminals and a small package, while also offering keying options to ensure proper mating and terminal position assurance (TPA) retainers to prevent terminal back-out.
SMPM and SMP RF Connectors - Molex introduces the SMPM and SMP RF Connectors that maximize performance in the smallest, compact spaces. These connectors reduce system weight while delivering superior reliability.
2.4/5 SMT Molded Interconnect Device Chip Antennas - Molex's 2.4/5 and 2.4GHz SMT Molded Interconnect Device (MID) Chip Antennas require no ground-place clearance and are WI-FI* ready, which enable wireless device makers to achieve higher levels of product integration with fewer components and lower costs.
FFC/FPC Connector with Easy On™ Front-Flip Actuator - Molex's low-profile FFC/FPC connector with Easy On™ front-flip actuator provides secure electrical and mechanical contact for consumer, gaming, office automation and other applications that require space savings and cost performance.
FiT Family Connectors - Offer power delivery and power distribution in wire-to-wire, wire-to-board and board-to-board configurations. Molex's FiT family of power connectors, which includes the Nano-Fit, Micro-Fit 3.0™, Ultra-Fit™, Mini-Fit® and Mega-Fit®, offer maximum design flexibility, space savings and long-term reliability.
Ditto™ Wire-to-Wire Connectors - Introducing "New" Ditto™ Wire-to-Wire Connectors with Positive and Friction Lock. Ditto wire-to-wire interconnects halve the tooling and setup costs of low-amperage consumer and lighting applications for increased cost-savings and operational efficiency.
Milli-Grid™ BMI Connectors - Introducing the new Milli-Grid™ BMI (Blind Mate Interface) Connectors. The new dual-row connectors feature a fully shrouded 2.00mm pitch header that offers the smallest blind-mating interface available for wire-to-board and panel-to-board applications across a variety of industries.
Miniature Memory Card Connectors - Molex's miniature memory card connectors with pin-style eject feature and card tray holder provide low profiles, easy card insertion and removal, and secure electrical contact for ultra-thin mobile devices.
Micro-Fit* TPA Single-Row Receptacle - Features a one-piece housing design with an integrated secondary lock to ensure proper mating and prevent terminal back-outs.
USB Type-C Connectors & Assemblies - More compact USB Type-C connectors offer greater PCB savings while enabling high-frequency mating in data, consumer and other I/O applications.
Nano-Pitch I/O™ Interconnect System - With industry-leading port density, multi-protocol application support , and high-bandwidth performance, the Nano-Pitch I/O Interconnect System is redefining PCIe and SAS solutions within the storage industry, as well as in broader markets, including mobile and enterprise.
LED Array Holders for Samsung Electronics and Similar LED COB Arrays - Simplify field servicing of LED lighting applications with push-button type LED Array Holders from Molex that enable easy wire insertion and removal without the need for an extraction tool.
Brad® Ultra-Lock® Connection System - The Ultra-Lock connection system surpasses performance and reliability of traditional threaded connectors, delivering increased productivity and cost savings.
FCT Electronics - FCT Molex specializes in designing and manufacturing custom mixed-layout connectors and cable assemblies. FCT also offers a range of standard connectors and contacts.
Manual Wire Stripper - This cutting and stripping tool has easily interchangeable multiple stripping cassettes that enable precision stripping of a wide range of insulations from PVC to PTFE with just one tool.
Molex PermaSeal™ Terminals - Perma-Seal terminals and splices provide a rugged, environmentally sealed connection for wire sizes 8 to 22 AWG that will insulate, seal and protect joints from physical abuse and abrasion, water, salt and other corrosive compounds
Molex In-Vehicle Smart-Charging USB - With the exploding growth of infotainment, automobiles are designed with multiple USB chargers, which can add to manufacturing costs.
Molex MediSpec™ Plastic Circular (MPC) Connector System - Combining premium performance and ease-of-use, MediSpec™ Medical Plastic Circular (MPC) Interconnect System incorporates proven cost-effective technology to meet the stringent standards of medical-device users
Molex NeoScale™ High-Speed Mezzanine System - Delivering the market's cleanest signal integrity at 28+ Gbps, Molex's modular NeoScale™ Mezzanine System features a high-speed triad wafer design with Solder-Charge Technology™ for customized PCB routing in high-density system applications
Molex MXL38999™ Connector System - High-density MXL38999™ connector system provides the industry's only full range of MIL-DTL-38999 solutions for single mode APC applications.
Molex HSAutoLink™ - This interconnect system leverages Molex's expertise at producing high-speed cable technology and adapting to needs of the emerging segment of the "Connected Vehicle" (Vehicle-to-Vehicle communications, Infotainment and Telematics)
Molex Lite-Trap™ and Mini Lite-Trap™ Connector System - Ideal for thin LED lighting-module applications, Molex's Lite-Trap™ and Mini Lite-Trap™ SMT wire-to-board connectors offer the lowest profile options available for wire-removable types, with an easy-to-use push-button latch
Molex DDR4 miniDIMM Sockets - Molex is the leading developer of miniDIMM connectors for a range of small form factor modules like SODIMM with the reliability and features of a full size DIMM connector.
Molex DuraClik - Molex's expanded line of DuraClik connectors provides space savings and superior performance features compared to competitive versions for high-vibration applications.
Molex MXP120™ Sealed Connector System - The MXP120™ Sealed Connector System from Molex is a high-performance 1.20mm terminal in-line connection system for automotive and commercial vehicles.
Molex Micro-USB Waterproof Connectors - Mechanically robust micro-USB connectors withstand post-solder reflow while preventing water ingression at IP67 levels. Safeguards costly application investments of mobile device makers and users. Ensures reinforced terminal retention to housing; mechanical robustness of part and superior co-planarity before and after reflow soldering.
Molex Mini-Fit Sr.™ Power Connectors - Molex unveils their Mini-Fit™ Power Connectors.
Molex SL™ Modular Connectors - Leading the consumer electronics and automotive industries with the largest number of variations and cabling configurations, SL™ Modular Connectors and Assemblies are ideal for low-power and signal wire-to-board and wire-to-wire applications.
Molex iPass+™ HD Interconnect System - Designed for large-scale data-center storage systems, industry-leading iPass+ HD Interconnects support SAS 3.0 signaling up to 100m with low power consumption, while reducing cable-management challenges.
Molex Automotive Bulb Sockets - Molex unveils an unparalleled selection of innovative Bulb Socket solutions that matches the needs of vehicle makers around the world for safety, performance, variety and robust features.
Molex Ultra Fit™ Power Connectors - Molex introduces a new series of high-density power connectors.
Molex Mini-Fit Jr.™ Power Connectors - Molex introduces the Mini-Fit Jr.™ Power Connectors.
Molex TermiMate™ Connector System - Molex introduces the sleek TermiMate™ wire-to-board and board-to-board system minimizes shadowing in LED lighting applications while providing space savings and reduced component costs
Molex DDR4 DIMM Sockets - Molex introduces the "New" DDR4 DIMM Halogen-Free Series.
Molex FFC/FPC Easy-On Connector Series - Introducing Molex's "NEW" 0.50mm pitch FFC/FPC Easy-On connectors.
Molex CP 6.5 Wire-to-Board Connectors - Molex CP 6.5 Wire-to-Board Connectors - Molex introduces the "New" CP-6.5 wire-to-board connector series.
Molex Spring Clips - Molex introduces "New" low profile, high durability spring clips that offer smartphone makers maximum cost savings with greater design flexibility and specific loading control.
Molex VersaBlade Wire-to-Wire Connector System - Molex VersaBlade™ Industry standard .070" tab type wire-to-wire system offers superior mating reliability, easy assembly and cost savings for White Goods/HVAC applications.
Molex iPass+™ High Density Active Optical Cables - Molex unveils new iPass+ High Density Active Optical Cables, which are designed for large-scale enterprise and data center storage systems.
Molex SlimStack™ Hybrid Power SMT Board-to-Board Connectors - Molex Unveils new SlimStack™ Hybrid Power SMT Board-to-Board Connectors, which are designed for battery and other power applications for mobile devices.
Molex ML-XT™ Sealed Connection System - Molex introduces the new rugged ML-XT™ connection system with market-leading, high-performance seal technology.
Molex SlimStack Armor™ Connectors - Molex introduces SlimStack™ fine-pitch connectors that are ideal for tight-packaging applications, such as mobile phones.