Molex's SolderRight Direct Solder Terminals are ideal for tight packaging constraints. The low-profile terminals enable right-angle connections to a PCB at a low applied cost.
From laptop computers to handheld devices, electronic systems, products, and packaging are becoming exponentially smaller. Until now, users were forced to either solder a bare wire into a PCB and bend it over (resulting in poor reliability and a higher-profile termination), or use a two-piece connector system (with a higher cost and higher profile). SolderRight™ Crimp Terminals solve both of these issues. With an industry need for low-profile packaging, reduced wire connections, permanently connected circuits, and higher standards of reliability, SolderRight Crimp Terminals are the only board-in crimp solder options in the market that address all of these points.
SolderRight Terminal 14-16 AWG Tin In Line Mount
SolderRight Terminal 18-20 AWG Tin In Line Mount
SolderRight Terminal 22-24 AWG Tin In Line Mount
SolderRight Terminal 26-28 AWG Tin In Line Mount
Features and benefits include:
Right-angle mounting orientation that provides super low-profile solder option for wires exiting a PCB (much lower than a “solder & bend” operation)
Multiple terminal/wire size ranges (14 to 28 AWG) that enable signal-to-power current capability while optimizing PCB space
Twin solder pins that provide unmatched stability for solder processing and allow redundant current paths
Solder pins positioned between the insulation and conductor crimps, which offer superior wire strain relief and resist terminal and solder joint breakage if wire is pulled
Single terminal, one-piece crimp design - one of the lowest-cost, most reliable, direct solder interconnects in the market
Lowered profile from 3.50 to 1.95mm, which allows minimum “z” height soldering profile for tight packaging constraints