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Molex Product News

Molex SpeedStack Mezzanine Connector System

Molex's SpeedStack™ Mezzanine Connector System delivers a high-density, low-profile solution with data rates up to 40 Gbps per differential pair.

The SpeedStack™ Mezzanine Connector System is ideal for space-constrained designs with limited PCB real estate. The durable low-profile, high-density system is ideal for applications such as telecommunications, networking, military, medical and consumer.

Part Number View Inventory
1714500106 SPEEDSTACK RECPT ASSY 60ckt 4mm

Features and benefits include:

Mated stack heights 4.00 to 10.00mm with a 0.80mm pitch   Provides design flexibility to address PCB space constraints
Multiple circuit sizes (22, 60 and 120) with a range of 6 to 32 differential pairs   Offers high-density signal solution with flexible pin counts
Split-pad PCB design   Allows for electrical tuning performance to reach data rates up 40 Gbps per differential pair Provides edgecard compatibility
100 Ohm impedance design   Provides superior impedance control
Robust insert-molded wafer design with protected shrouded housing   Provides support to the terminal location to improve electrical balance within the signals for low-profile, high-density systems
Low-profile, ergonomic narrow housing design   Minimally obstructs airflow to promote system cooling
Shielding grounding pin   Improves electrical performance and minimizes cross-talk
85 Ohm impedance versions in development   Will support PCIe Generation (Gen) 3.0 and Intel QuickPath Interconnect (QPI) requirements for next-generation I/O and memory signaling


Aerospace and Defense

  • Scanning Equipment


  • Cameras
  • Hand-held scanners


  • Scanner


  • Routers
  • Servers
  • Storage
  • Switches


  • Base stations
  • Mobile applications
  • Remote radio antennas

See also:
Molex SpeedStack Mezzanine Connector System (.pdf) for more product information, specifications, applications and ordering information.

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