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Molex

Molex Product News

Stac64™ Single, Multipocket and Hybrid Header System

To address the growing electronic device requirements within today's vehicles, Molex has developed a modular 0.64, 1.50 and 2.80mm terminal header system. The Stac64 connection system allows OEM and device manufacturers greater design flexibility to support both low-level signal requirements as well as power applications up to 30.0A. The Stac64 system allows automotive manufacturers to use header assemblies as stand-alone components, to gang multiple headers together to support a large range of signal and power needs for devices and modules.

The standard product line based on the 0.64mm pitch terminal includes: 8-, 12-, 16- and 20-circuit connectors in both vertical and right-angle headers supporting low-level signal requirements. In addition, 10- and 14-circuit power pocket versions, supporting power applications for 1.50 and 2.80mm pitch terminal systems, are available in vertical and right-angle configurations. This Stac64 is a standard product system based on USCAR-2 Class II mechanical and electrical performance characteristics for unsealed connector applications. The connectors mate to existing wire-harness connectors designed to the USCAR/EWCAP industry footprints.

The Stac64 standard product offering is tooled at high cavitation and is fully validated at the single-pocket level. This greatly reduces time-to-market by eliminating the need for additional tooling.

Features and benefits include:

Stackable connection system of readily available PCB headers Reduced time-to-market: engineering and validation times reduced significantly
The header and receptacle housings are molded in standard USCAR color schemes for additional polarizations No tooling necessary to produce custom multi-bay headers
Pre-assembled, linear Mylar PC tail alignment strip for right angle headers Matches harness connector color coding scheme for visual aid in assembly
Modular-housing design with standard dovetail features molded into the housings Reduces PCB packaging complexity

Provides space savings

PCB alignment posts Allows headers to be ganged together in large assemblies to meet growing terminal quantity requirements
PCB standoffs molded into housings Ensure all terminals are properly aligned into PCB board through-holes during assembly

Retain header to PCB during assembly and solder processing

High temperature thermoplastic housing Withstand infra red (IR) and wave lead-free solder processing per SMES-152 Molex specification
Pre-assembled TPA to receptacle housing shipped as single assembly Applied assembly labor and cost savings

Applications include:

Automotive

  • Door Zone Modules
  • Interior Lighting and Navigation
  • Navigation Systems
  • Power Seat Modules
  • Radios/DVD - Entertainment

Commercial vehicle

  • Interior Electronic Modules

See also:
Stac64 Connection System (pdf) for more product information, specifications, applications and ordering information.


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