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Molex Product News

Impact™ Backplane Connector System

Molex’s Impact™ Backplane Connector System provides data rates up to and beyond 25 Gbps along with superior signal density up to 30 pairs per cm (80 differential pairs per inch). The broad-edge-coupled transmission technology enables low cross talk and high signal bandwidth while minimizing channel-performance variation across every differential pair within the system.

Impact™ XTR provides a scalable solution for enhanced electrical performance while maintaining backwards compatibility. Shielding technology is added to the daughtercard side only that will mate with existing backplane headers in the field.

Impact™ 85 Ohm Plus leverages the 100 Ohm technology, density and footprint that offers an electrically enhance solution with the addition of a plus clip which improves common mode erformance.

Impact™ Orthogonal Direct eliminates the midplane, enabling customers to reduce cost, improve electrical performance and remove thermal barriers.

Impact™ Orthogonal Midplane reduces channel lengths and midplace complexity and costs. Daughtercards can be vertically mated on one side of the midplane and horizontally on the other.

Impact™ Power is offered in 3- through 6-pair sizes in conventional, coplanar and mezzanine configurations, with current ratings from 60.0 to 120.0A per module.

Designed for traditional backplane and/or midplane architectures, the Impact™ Backplane Connector System meets the growing demand for next-generation high-speed applications.

Features and benefits include:

Data rates scalable up to and beyond 25 Gbps Support future system performance upgrades (standard Impact connectors achieve up to 25 Gbps; XTR Impact 100 Ohm connectors achieve beyond 25 Gbps)
Broad-edge-coupled, differential-pair design Superior density, low cross-talk, low insertion loss and minimal performance variation across all high-speed channels
Shield-to-wafer construction on XTR daughtercards Lowers cross-talk, adds signal integrity margin and is optimal for ungrouped Tx and Rx applications
Supports quad routing for a reduced PCB layer count
Density up to 30 differential pairs per cm (80 differential pairs per linear inch) Supports high bandwidth needs while minimizing board and system real-estate usage
Inline staggered mating interface Reduced mating force by 40% over competing products in the market while providing two points of contact for long-term reliability
Simple 1.90 by 1.35mm grid Provides PCB routing flexibility and reduces cost
Two compliant-pin options (0.39 and 0.46mm) Provides customers ultimate flexibility to optimize designs for superior mechanical and electrical performance
IEEE 10GBASE-KR and Optical Internetworking Forum (OIF) Stat Eye Compliant channel performance Demonstrates end-to-end channel performance compliance
Versatile configuration options available including conventional, coplanar, mezzanine, orthogonal, and orthogonal direct Enables customers to leverage the same broad-edge coupled technology across many system architectures
Orthogonal Direct configuration available offering a two piece midplane solution in either a 90 degree or 270 degree rotation Improves airflow, removes via in channel, reduced total number of components and system flexibility

Applications include:


  • Servers
  • Storage


  • Diagnostic imaging
  • Healthcare IT


  • Cellular infrastructure
  • Hubs
  • Routers
  • Switches
  • Telecommunications hardware

See also:
Impact 100 Ohm Backplane Connector System (.pdf) for more product information, specifications, applications and ordering information.

Impact 85 Ohm Backplane Connector System (.pdf) for more product information, specifications, applications and ordering information.

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