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Molex Product News

Vertical SMT Modular Jacks

Molex's Vertical SMT Modular Jacks with Kapton tape for vacuum pick-and-place functionality can streamline high-volume PCB production and lower manufacturing costs.

Automatic vacuum pick-and-place is the most common high-speed manufacturing process for precision placement of surface mount (SMT) components on printed circuit boards (PCBs) in mass production. The addition of Kapton tape to the surface of vertical SMT modular jacks facilitates automatic vacuum pick-and-place of the connector alongside other SMT components. This streamlines high-volume production and lowers manufacturing costs for customers.

Features and benefits include:

SMT vertical mounting with added Kapton tape

Automatic vacuum placement possible; lowers customer manufacturing costs

Kapton polyimide film remains stable across a wide range of temperatures

Suitable for high-temperature SMT manufacturing; Kapton tape willkeep its form, bond and integrity

Low-profile versions (series 85513) available

Allows for tight board stacking

RJ-11 and RJ-45 jacks available

Provides flexibility for variety of design applications

50µ" Gold plating options

Meets FCC68.5, IEC60603-7 and is approved for all FCC and IEC licenses applications

Palladium nickel (PdNi) + gold (Au) flash plating option

Achieves 2500 mating cycles; meets the new durability requirement of IEC60603-7 PL 2 and FCC68.5 standards



  • Servers
  • Switches
  • Routers


  • Vending machines
  • Cash registers
  • Card swipes


  • Set top boxes
  • Home security
  • Web TV
  • Gaming devices


  • Printers
  • Photocopiers
  • Desktops & laptops


  • Home analysis monitors
  • Bed monitors
  • Breathing devices


  • Control units
  • Vision systems
  • Security systems
  • Test equipment

See also:
Vertical SMT Modular Jacks (.pdf) for more product information, specifications, applications and ordering information.

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