Molex Micro-Fit 3.0™ Interconnect System

3.00mm (.118") pitch connectors are the perfect choice when you need compact connectors that carry up to 5.0A of current.

The Micro-Fit 3.0 connector is a unique interconnect system designed to meet the need for a high contact density signal or power connector and incorporates many of the features previously found on larger power connectors. These 3.00mm (.118") pitch connectors are the perfect choice when you need compact connectors that carry up to 5 amperes of current. Micro-Fit products are available in circuit sizes 2 to 24 for single and dual row, wire-to-board and wire-to-wire applications. The product family has many retention choices including fitting nails, solderable clips, and offset terminal retention.

The Micro-Fit 3.0 CPI™ and Micro-Fit 3.0 BMI™ CPI (blind mate interface) are compliant pin interface vertical header product extensions to this well known Micro-Fit family. These products are designed for high-density applications which require press-fit headers. The CPI products are appropriate for both power and signal uses as they can carry up to 5 amperes per circuit.

Micro-Fit 3.0 Overmolded Cable Assemblies are available in multiple circuit sizes and cable lengths, featuring a rugged strain relief for signal and power applications.

Key Features:

• Headers made of high-temperature LCP material
• SMT, Press-Fit or Surface Mount Compatible versions available
• Fully polarized housings
• Positive latching
• Locking tang on terminal
• Various retention options including fitting nails and solderable clips
  

See also:
Micro-Fit, 3.0™ Family Overview (.pdf) for more product information, available configurations, max current, version and othe features.