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Molex



DDR3 DIMM Memory Module Sockets Increase data bandwidth and performance for demanding memory applications

DDR3 is an established DDR DRAM interface technology that offers more bandwidth and higher performance at lower power for demanding memory applications in desktop PCs, servers and notebook computers. It finds expanding use for high-performance embedded systems in telecommunication, networking and storage systems, advanced computing platforms and industrial controls. DDR3 supports data rates of 800 to 1600 Mbps with clock frequencies of 400 to 800 MHz (respectively); effectively doubling the speed of DDR2. With a standard operating voltage of 1.5V, DDR3 cuts power consumption of DDR2 by up to 30%.

Molex offers manufacturing capability for ultra-low-profile DDR3 DIMM sockets with low level contact resistance only 10 milliohms (maximum initial). These sockets support the unregistered DDR3 DIMMs as well as Registered DIMMs (RDIMMs) for reduced power consumption in data systems.

Part Number View Inventory
78079-0001 Thru Hole, Standard contact material, 3.3mm SP
78543-0001 Thru Hole, Standard contact material, 3.3mm SP, Halogen Free
78321-0001 Thru Hole, LLCR contact material, 3.3mm SP
78588-1502 Thru Hole, LLCR contact material, 1.1mm SP
78443-1001 Press Fit, LLCR contact material, 3.3mm SP
78556-5001 Press Fit, LLCR contact material, 2.4mm SP, Aero Body, Standard latch
78315-0001 Press Fit, LLCR contact material, 2.4mm SP, Aero Body, VLP latch
78156-0001 SMT, Standard contact material, 3.3mm SP
78378-0001 SMT, LLCR contact material, 3.3mm SP
78507-0001 SMT, LLCR contact material, 2.4mm SP
78565-0001 SMT, LLCR contact material, 2.4mm SP, Aero Body, Standard latch
78603-0001 SMT, LLCR contact material, 2.4mm SP, Aero Body, VLP latch
78373-0011 25 Degree, Thru Hole, Standard contact material, 3.3mm SP
78359-0011 25 Degree, Thru Hole, Standard contact material, 2.4mm SP
78315-0011 - Aero Design, PF, VLP (14.26 tall), 2.60 tail, 30u" gold

Features and Benefits:

  • Accepts JEDEC defined module MO-269 and complies with JEDEC SO-007 socket specs for 100% industry compatibility - Leveraging on the strong existing memory product line, many different configuration of the product (such as VLP, SMT version) will be made available in the future
  • High temperature thermoplastic housing for lead-free processing - Robust contact design ensure product suitable for high field-life applications
  • Ultra-low-profile sockets
  • Ultra-low seating plane of 1.10mm height - Frees up vertical module space to allow use of high-density DIMMs while maintaining the same design height; Enables the use of very low-profile modules with seating heights below 2.80mm (maximum) in ATCA* blade systems
  • Low-level contact resistance of 10milliohms (maximum initial) - Supports the use of Registered DIMM (RDIMM) modules and reduces power consumption in blade servers
  • Reduced latch-actuation angle - Creates more room for neighbouring components while improving airflow space around memory module socket

Applications:

  • Data/Communications: Desktop computer, Servers, Workstations
  • Industrial Automation: Programmable Logic Controllers
  • Medical: Imaging equipment
  • Networking: Router/Switch, Servers, Storage systems
  • Telecommunications: Base stations
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