Molex Fully Buffered DIMM Socket Handles More Memory at Higher Speeds
LISLE, Ill. – February 19, 2007 – Performance requirements are demanding more memory capacity at higher speeds. To meet this need, Molex announces the new Fully Buffered DIMM (FB DIMM) Socket. Unlike the limited capacity of current shared bus architecture, the FB DIMM channel features a point-to-point serial memory interface that uses a bi-directional serial memory bus to pass data through each memory module to increase storage capacity and speed.
As memory data rates increase in current shared bus architecture, the number of memory modules that each bus can support decreases. With a bi-directional serial memory bus, the FB DIMM Socket passes data through each memory module instead of loading all of the data onto a single memory bus. These features make the next generation FB DIMM Socket well-suited for server applications found in computing, including high-end workstations; blade servers, rack-optimized servers and mainframe servers; as well as telecommunication applications, including routers and switches. Additionally, the 1.00mm (.039”) pitch, 240-circuit sockets are available in 28.5° angle, through-hole; vertical, through-hole; and press-fit styles to serve customers’ different application needs.
“The market need for higher performance servers has doubled memory bit density every two years,” said Paul Ee, senior product engineer, Molex. “At this rate, current shared bus architectures will not be able to support the increased size and memory capacity that is required. The Molex FB DIMM Socket handles this increased capacity at 6 times the current speed of DDR2 to meet customers’ present and future high-end memory needs.”
The FB DIMM Socket features built-in end keys, as well as a central alignment key, which ensures correct insertion of a FB memory module. Its dual ejector latches make inserting and removing modules easy and minimize micro motion to improve reliability. It also features 3 metal forklocks, or plastic pegs, to provide the proper socket-to-PCB alignment and retention during and after soldering the product in place. A latch tower support keeps the module vertical, and its robust contact design enables a long field life suitable for server applications. It also features high-temperature thermoplastic housing, which makes it lead-free process compatible.
Molex is an active member of the JEDEC JC11 committee that defines the mechanical features and dimensions for industry standards for memory modules and sockets. The FB DIMM Socket accepts JEDEC-defined module MO-256 and complies with JEDEC SO-003 socket specifications to ensure 100 percent industry compatibility.
The FB DIMM Socket offers a high performance solution at a cost-effective price. Lead time is approximately 6 weeks.
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