Micro-Fit* TPA Single-Row Receptacle features a one-piece housing design with an integrated secondary lock to ensure proper mating and prevent terminal back-outs
The Molex Micro-Fit 3.0™ Interconnect System is designed to meet the need for a high contact density signal or power connector . The Micro-Fit 3.0 connectors are a miniature 3.00mm (.118") pitch, but retain many of the features found on larger power connectors and can carry up to 5.0A of current. Molex Micro-Fit products are available in circuit sizes 2 to 24 for single and dual row, wire-to-board (W2B) and wire-to-wire (W2W) applications such as computers, work stations, satellites, cellular phones, and a host of consumer products.
Features and Benefits:
Terminal position assurance (TPA) with integrated secondary lock - Reduces assembly error that results in terminal back-outs
Compatible with all existing Micro-Fit* 3.0 headers and plugs - Enables customers to implement running change to incorporate the TPA design. Removes the need to change both sides of the interface or to make significant revisions or investments in their applications.
One-piece housing and terminal lock design - Eliminates secondary pieces, which can be lost
Single-row, wire-to-wire and wire-to-board configurations immediately available with 2 to 7 circuits; Contact Molex for 8 to 12 circuits - Provides design flexibility