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Molex Product News


Molex Nano-Pitch I/O™ Interconnect System

Molex introduces their "New" Nano-Pitch I/O™ Interconnect System with an industry-leading port density, multi-protocol application support and high-bandwidth performance.

The Nano-Pitch I/O Interconnect system is redefining PCIe and SAS solutions within the storage industry, as well as in broader markets, including mobile.

Molex's Nano-Pitch I/O Interconnect System benefits high-performance applications by delivering robust, small form factor, high-speed and multi-protocol interconnects ideal for both internal and external applications. The low profile design provides four transmit and receive lanes.

Maximizing next generation PCIe, SAS and SSD benefits while minimizing space and cost are outstanding benefits to the end user from the new Molex design.

Over the past decade, data transfer needs for increased port density and speed in smaller packaging have emerged in markets from consumer electronics to enterprise servers and storage. What these customers desire are easy, simple download capabilities to external storage systems across a multitude of protocols. Different connectors have been made to solve these issues, but none are as dense, fast, and small as the Nano-Pitch I/O Interconnect System (NPIO)from Molex.

Enabling customers to move data at 24 Gbps per lane, the Nano-Pitch I/O Interconnect System is compatible with all known PCIe, SAS, and SATA protocols, as well as future-proofed for PCIe Gen 4 (16 GT/s) and SAS 4 (24 Gbps). This system will solve space and performance issues in download systems well into the future.

 

Part Number View Inventory
171982-0142 NANO-PITCH I/O CONN, R/A RCPT
171982-1142 NANO-PITCH I/O CONN, R/A RCPT
171983-2042 NANO-PITCH I/O CONN, VERT RCPT
171982-0142 CUT TAPE - NANO-PITCH I/O
171982-1142 CUT TAPE - NANO-PITCH I/O
171983-2042 CUT TAPE - NANO-PITCH I/O

 

Features and benefits include:

  • Flexible pinout concept optimized for high-speed applications maximizes the number of high-speed lanes within lengths provided.
  • Mulit-protocol solution that adheres to a variety of industry standards.
  • The extremely small form factor design: 5.00mm H by 15.00mm W by 9.00mm D and a 12.00mm mated connector-to-cable assembly heights allows high speed and high bandwidth in a small form factor I/O connector.
  • Staggered, reliable and constant dual-row contact configuration allows for hot pluggability, which is the ability to add components without having to shut down the system.
  • Versatile metal shell housing provides an internal or external solution, with a low mated height that fits within the maximum component height of PCIe add-in cards.
  • Vertical and right-angle PCB mounting options allow internal and external system design flexibility with surface-mount and intrusive reflow options.
  • Mezzanine and parallel solutions available, which provide industry-leading application flexibility across almost any arrangement of boards within a system.

Applications:

  • Storage Systems
    • Data Center and Enterprise Storage Systems
    • Storage Racks
    • JBODs
    • Storage Controllers
    • HBA (Host Bus Adapter) Servers
    • RAIDS (Redundant Array of Individual Disks)
  • Telecommunications/Networking
    • Hubs
    • Servers
    • Switches
    • Routers

See also:
Molex Nano-Pitch I/O™ Interconnect System (.pdf) for more product information, specifications, applications and ordering information.
Molex Nano-Pitch I/O™ Interconnect System for Datacom/Networking (.pdf)

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