FOR IMMEDIATE RELEASE
DesignCon 2008: Molex Incorporated To Showcase
High Performance Interconnect Technologies
LISLE, Ill. – January 23, 2008 – Molex Incorporated announced today that it will conduct several live demonstrations featuring its newest and highest performing interconnect solutions at DesignCon 2008, February 4-7.
Press members and show attendees are invited to visit Molex, (booth 511) to see and discuss the latest in interconnect design solutions, including:
- The Impact™ backplane connector system – Pushes the speed and density envelope to meet the next generation requirements of telecommunications and data networking equipment. The Impact system provides up to 80 differential pairs per linear inch in less than 29mm total width, making it the fastest, densest backplane connector on the market today.
- The I-Trac™ backplane connector system – Is a broadside-coupled, skew-equalized, 12.5 Gbps solution with low cross talk and superior impedance control. A unique feature of the I-Trac system is the capability to use the same standard connector blocks for both traditional and orthogonal architectures. I-Trac 7-, 11- and 15-row designs are currently used in market leading 10 Gbps and IEEE 802.3ap 10GBASE KR platforms.
- The HDMezz™ and SEARAY* board-to-board connectors - Simplify PCB routing without sacrificing performance for applications with high pin-count devices on mezzanine cards or module PCBs. Moreover, they provide multiple benefits on personality or expansion cards for use in networking and telecommunication equipment, mid and high-range computers, medical equipment, military products and industrial controllers.
- SFP+ interconnect System - Meets the next generation Small Form-factor (SFF) 8431 specification to enable next generation speeds of standard SFP applications. An easy upgrade from SFP, the SFP+ system handles data rates up to 10 Gbps to support 8 Gbps Fibe Channel and 10 Gbps Ethernet applications, in the same form factor as standard SFP.
*SEARAY is a trademark of Samtec, Inc.
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