Press Release
For Immediate Release

Molex Incorporated Becomes a Member of UXPi

LISLE, IL – April 20, 2004 – Molex Incorporated (NASDAQ: MOLX and MOLXA) has become a member of the Unified 10Gbps Physical-layer Initiative (UXPi). The goal of UXPi is to promote a common physical layer standard for serial chip-to-chip and backplane data transmission at 10 Gbps. Molex joined UXPi to help develop and promote the standard and to bring expertise in the area of backplane connectors.

Launched by a group of semiconductor companies, and now composed of a diverse array of 17 different companies, UXPi was created to help designers of silicon integrated circuits, printed circuit boards and complete systems overcome the challenges associated with 10 Gbps data transmission. If successful, UXPi will result in broad-based interoperability, reduced development costs and a shorter time to market for systems customers.

According to David McCallum, a Strategic Product Manager with Molex Incorporated, the company plays an active role in data transmission by developing and manufacturing backplane connectors that meet the most stringent performance demands.

“The adoption of a common serial data transmission standard across multiple markets will simplify and accelerate the implementation of next generation 10 Gbps systems,” said McCallum. “To leverage its industry-leading position, Molex is working closely with UXPi to develop the standard and to accommodate Molex’s backplane connectors in the standard.”

UXPi is organized as a program under the IEEE-ISTO, which provides a legal and administrative platform on which UXPi operations can progress. UXPi plans to work with numerous contributing and adopting companies to develop, refine and make the specifications available. UXPi founding members include Applied Micro Circuits Corporation, International Business Machines Corp. Infineon AG Texas Instruments Incorporated and Xilinx, Inc.

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