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November 2004
Samtec RISE-UP™ System Improves Elevated High Speed Board Stacking Performance
Samtec's new RISE-UP™ high speed interconnect system (RU8 Series) uses two standard micro-card connectors (HSEC8 Series) and a matched impedance PCB with an embedded ground plane (HSC8 Series) for greatly improved performance over traditional connector sets for elevated board stacking.
Typical performance at 25mm (one inch) board spacing is 2.5 GHz from the single-ended system and 3.5 GHz for the differential pair system. Performance can be improved over these values by dedicating some signal pins for additional ground pins.
Off -the shelf systems are available with single-ended (50 or 70 I/Os) or differential pair (33 or 46 I/O pairs) routing with a standard 25mm stack height. Application specific boards for other stack heights are cost-effective and available with a quick turnaround.
Connector interfaces are also available for perpendicular daughtercard type applications and horizontal or coplanar "pizza box" applications.
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