Flexible High Density Power Interconnects Introduced from Samtec

Samtec has introduced a new high density power-to-board interconnect system on 2mm (.0787") pitch (TPCM/TPCF Series) that can be used for elevated board stacking. These four-row interconnects can carry 27 amps at 80oC over four banks of four power pins each. An eight-bank system is currently being tested for power rating. Power banks are separated from the nearest signal pins by 3.5mm to maximize the power capacity.

For board stacking applications, the board spacing with standard connectors can range from 10mm (.394") to 20mm (.787"). End shrouds assure proper mating in blind applications, and Tiger Buy tuning fork style Phosphor Bronze contacts provide high retention and cost effectiveness. Pricing begins .06¢/.08¢ per mated line.

Samtec has a broad line of Power Interfaces for board-to-board and discrete wire-to-board applications. Discrete wire connectors are available on 4,19mm (.165") pitch (IPBD Series) and 2,54mm (.100") pitch (IPL1 Series) and headers and sockets (IPBT/IPBS and IPT1/IPS1 Series) are available for vertical board stacking and perpendicular applications. Pricing begins .015¢ (IPBD Series) per line and .08¢ (IPT1/IPS1 Series) per mated line.

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