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High-Temperature Devices are Ideal for Test and Burn-In Applications Where Thicker Daughtercards are Employed

San Marcos, CA, December 6, 2007 - Sullins Electronics, a world leader in the design and manufacture of RoHS-compliant board level interconnect products, today announced the expansion of their edgecard connector portfolio to include a high-temperature, dual-readout series manufactured to accept 0.093” (2.36 mm) thick daughtercards. These new edgecard connectors join Sullins’ extensive offering of components engineered for high-temperature applications, which includes straight and right angle card extenders. Made of high-density dielectric materials, parts may be ordered to withstand 150 degrees C continual heat. The UL/ cUL Recognized connectors feature high-density 0.050” (1.27 mm) contact center spacing and easily replace 0.100” (2.54 mm) center spacing parts to double the number of contacts within the same area. They moreover provide the utmost in design flexibility as they are supplied in straight, card extender, and right angle configurations.

A perfect solution to high pin count, high-temperature applications where space conservation is critical, Sullins’ newest connectors may be confidently specified in a wide array of such industrial, consumer, and commercial applications as electronic component testing, communication, medical equipment instrumentation, and automotive R&D. Notably, as they facilitate the reliable connection of one printed circuit board (motherboard) to a 0.93” daughtercard, they are uniquely suitable for use in power converters, power supplies, and test and burn-in ovens where thicker daughtercards are frequently employed to minimize warping on larger backplanes.


The Series is manufactured with BeCu (beryllium-copper) contacts and PA9T insulators for applications demanding the temperature range of -65 degrees C to +150 degrees C, or with phosphor-bronze contacts and PA9T insulators for use in -65 degree C to + 125 degrees C temperature applications. Provided with from 6 to 100 contact positions, they boast a mated signal contact bulk resistance (daughtercard mated to backplane module) of 30 milliohms maximum. The Series additionally features an insulation resistance of 5,000 Megaohms minimum at 125 VDC, a single contact current rating of 3 Amps, and a signal contact normal force of 75 grams minimum. Selective gold or overall gold plating, along with customization is accommodated. Devices are engineered for conventional reflow soldering to maximize manufacturing efficiencies and reduce time-to-market.

Typical pricing for Sullins’ new series of high-temperature, dual-readout edgecard connectors, which accept 0.093” daughtercards, ranges from $0.35 to $0.65 per contact pair in production quantities. While delivery is 3-4 weeks ARO, samples are immediately available.

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