SULLINS OFFERS EDGECARD CONNECTORS TO ACCOMMODATE 0.031” to 0.125” THICK DAUGHTERCARDS
San Marcos, CA, August 10, 2007 - Sullins Electronics announced the availability of standard edgecard connectors engineered to accept daughtercards ranging in thickness of from 0.031” (0.79 mm) to 0.125” (3.18 mm). These connectors are designed to address OEM’s and assembliers’ requirements for fast delivery of competitively priced connectors used to interconnect non-standard thickness boards often employed in custom, and next-generation applications. Supplied with contact centers of 0.100” (2.54 mm), 0.125” (3.18 mm), and 0.156” (3.96 mm), they are manufactured to meet or exceed the industry’s highest electrical and mechanical standards. Moreover, the UL94-0 rated parts may be ordered with an extended operating temperature range of from -65 degrees C to +150 degrees C.
Sullins’ edgecard connectors are commonly used in the broadest spectrum of applications including communications systems, medical equipment, instrumentation, and automotive R&D. Notably, high-temperature parts that accommodate 0.093” (2.36 mm) or 0.125” (3.18 mm) daughtercards may be confidently specified for such applications as test and burn-in ovens, where thicker daughtercards are employed to minimize warping on larger backplanes. Conversely, in medical equipment or any application where size and weight are critical factors, parts designed to accept 0.031” boards are the ideal solution.
Boasting a single contact current rating of 3 Amps, the devices’ mated signal contact bulk resistance (daughtercard mated to backplane module) is 30 milliohm maximum. They also feature insulator heights of 0.431” or 0.610” and are provided with a choice of dip solder, eyelet, right angle, card extender, and wire wrap terminations. A wide choice of insulator, contact material, and contact finishes is offered. Connectors with a molded-in polarizing key are also available. Sullins is now accepting requests for custom parts to connect ultra-thin and especially-thick daughtercards.
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