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TE Connectivity



TE Connectivity Anti-Buckling Micro-SIM Connector

TE Connectivity (TE) introduces one of the market’s lowest-height, anti-buckling, push-pull micro SIM connectors. This new connector is compatible with a micro SIM card, also called the third-form-factor (3FF) micro SIM card, which is the current mainstream standard for mobile devices such as GPS, mobile hotspot, wireless routers, tablets and cell phones. Used with an adaptor, the latest nano SIM card, also called the fourth-form-factor (4FF) SIM card, can also be applied to this new connector. The low-height feature benefits mobile device manufacturers by supporting the design of thinner devices. With this new anti-buckling feature, the micro SIM connector prevents the SIM card from scratching both the connector and the card. This prevents the SIM card from getting stuck inside the device, providing a more reliable, long-term solution.


 

Key Benefits:

  • Enable ultrathin design with 1.18mm overall height
  • Prevent buckling when using a nano SIM card or a micro SIM card due to the gradual-slope design of the new contact
  • Provide smooth push-pull function with an “anti-misinsertion” design
  • Allow easy retrofit from existing 1.24mm height connectors to the new 1.18mm height connectors with compatible PCB layout
  • Offer excellent contact performance with dual contact pin

Applications:

  • Handsets
  • Tablets
  • Ultrabook Devices
  • Laptops
  • Personal GPS
  • Portable GSM Modems
  • Electronic Readers
  • Payment Terminals
  • Servers
  • Mobile Phones
See also:
TE_Connectivity_Anti-Buckling_Push-Pull_Micro-SIM_Connector.pdf for more product information, specifications, applications and ordering information.

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