MENLO PARK, Calif. -- Oct. 18, 2011 -- TE Circuit Protection announces the RTP200R060SA device, the latest in the series of Reflowable Thermal Protection(RTP) devices that offer a convenient, cost-effective alternative to typical thermal fuses. RTP devices help protect against thermal-runaway damage caused by MOSFETS, capacitors, ICs, resistors and other power components that can crack and fail.
The new device provides a lower 0.6m Ohm (typical) series resistance than the initial RTP device offerings, as well as high-voltage capacity (32VDC) and high-current DC-interrupt ratings of 200A at 16VDC. These characteristics make it suitable for automotive applications such as HVAC, ABS, power steering modules, DC/DC converters and PTC heaters. The device also helps protect power components in IT servers, telecom power, LED lighting systems and appliance electronics.
Unlike radial-leaded thermal fuses, which must be installed after reflow, the RTP device allows use of standard surface-mount production methods, obviating the need for special assembly procedures and their associated costs. The RTP device's 200 degrees C open temperature helps prevent false activations, particularly in automotive environments, where a must-not-trip requirement exists for temperatures of 175 degrees C.
To allow it to open at 200 degrees C in the field, the RTP device utilizes a one-time electronic activation process to become thermally sensitive. Before activation, it can withstand three Pb-free solder reflow steps (260 degrees C peak) without opening. Arming can be implemented during system test, or in the field.
TE Reflowable Thermal Protection (RTP) device is a low resistance, robust surface mountable thermal protector. It has a set open temperature and can be installed using
reliable, lead-free, Surface Mount Device (SMD) assembly and reflow processes.
The RTP device described in this overview can withstand the demanding environmental,
life, and reliability requirements of automotive and industrial applications, including shock,
vibration, temperature cycling, and humidity exposures. In the field, the RTP device opens
if its internal junction exceeds the device's specified open temperature. Temperature
increases can have multiple sources, one of which is component failure (i.e. when using
power components such as a power FET, capacitor, resistor, triac, etc.). The RTP device
open temperature is selected so that the device does not open within normal component
operating windows, but it does open in a thermal runaway event and before the melt
temperature of typical lead free solders.
To simplify installation, improve reliability, and optimize thermal coupling with the PCB,
the RTP device is surface mountable. No special SMD installation is required. Instead,
after installation, the RTP device utilizes a one time electronic arming process to become thermally sensitive. Before the arming procedure, the device can go through installation
temperatures up to 260°C without going open. After arming, the device will open when
the critical junction exceeds the open temperature. Arming can occur during test, or in