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TE Connectivity

FOR IMMEDIATE RELEASE


COST EFFECTIVE SOLUTION FOR HIGH-DENSITY AND HIGH PERFORMANCE

--Z-PACK TinMan Connector Operates at 10 to 12.5 Gb/s Data Rate --

TE Connectivity's new Z-PACK TinMan backplane connector is a cost-effective solution for system designers searching for a high-density, high-performance backplane interconnect system capable of operating at 10 to 12.5 Gb/s. The connector has successfully demonstrated 10 gigabit data streams performance across the backplane compliant to 10Gbase-KR electrical requirements. The connector system is ideally suited to board-to-board interconnect needs of today’s demanding applications in switches, servers/blade servers, routers and storage equipment.

Ground contacts positioned within each pin header column, combined with unique contact lead frame arrangements and a receptacle side ground shield, enable the connector to achieve low crosstalk and high through-put performance levels. A dual point of contact mating interface and compliant pin interface to the pcb provide reliability.

The connector design follows industry backplane convention by offering a fully protected right-angle receptacle for daughtercards where handling damage can be a concern when mating to a vertical male header. This connector configuration permits field repair at either the module or single pin levels.

The product is available in a variety of module types and sizes to provide optimum flexibility to equipment designers chartered with developing architectures and platform that consider potential solutions for equipment generations several years beyond. The introduction of extensions and enhanced versions will permit a future-proofing approach.

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