About Heilind Electronics

About Heilind

Webinars On-Demand


New Trends in the Design of Your Next Connected Health Device

Demand continues to grow for advanced, on-body medical devices across the medical community, especially in connected health and combination therapy applications. Device manufacturers will need to engage increasingly complex circuitry to create real-time, lifesaving connections between doctors and patients.

At the heart of this medical innovation: connected devices and the data they transmit between major subsystems - sensors, processors, user interfaces, communication and power. This expansion of subsystems and features to drive increased information analytics creates design challenges for developers to maintain light, flexible and comfortable low-profile end products.

Attend this webinar to learn:

  • How to deal with data that needs to be sent/displayed quickly
  • The benefit of flexible cables within medical applications
  • Working within space constraints that require profile flexibility
  • Heilind and Molex solutions to achieve maximum power in minimal space


Anthony Kalaijakis, Strategic Industry Marketing Manager, Molex
Brad Eissler, Business Development Manager, Molex
Halie Henley, Project and Product Manager, Molex
Mike Santora, Moderator | Editor, Design World

Reduce the Risk of Equipment Failure with Efficient Wire Termination Solutions

When designing an electrical system, reducing the risk of failure is a top priority. By making the best selections and ensuring proper installations of the termination, you can be sure your end product will meet industry standards.

In this Webinar, you will learn about the efficient process to properly crimp and install connections to help meet the needs of your application. The presentation will also discuss tips on what to look for to ensure quality performance and reliability while reducing service work.

Vince Barone, Product Strategy Manager at Panduit Corporation
Brendan Haas, Product Manager of Terminals, Reelsmart, and Wiring Duct products at Panduit Corporation

Optimized Interconnect Solutions for Design Flexibility in Portable Devices

If you are an engineer or commodity manager looking to learn more about emerging technologies for portable devices, be sure to register for this informative on-demand session.  

Join our speaker, Kenta Minejima, as he dives into an in-depth overview of the emerging USB Type-C connector and cable standard, providing insights on the different requirements supported - including levels of power, data, and video, the various design advantages, and the different connector and cable options for each application. He will also provide information on compact FPC connectors that can be used as an additional internal interconnect between the external I/O and main board for compact device designs. Many times an extra internal interconnect is necessary between the external I/O and the main board when all components cannot be mounted on the main board, due to the shape of the device housing or varying heights of components mounted on the board. Learn how new compact FPC connectors can help solve this issue while providing up to 10A power for fast charging.

Attend this webinar and learn:

  • The USB Type-C industry standard and the advantages it provides
  • USB Type-C connector and cable variations commonly available and how to best implement them
  • How to use Board to FPC connectors for internal power and data transmission to maximize design flexibility

Kente Minejima, Marketing Manager, JAE Electronics

New Power Technologies Reduce Failures, Improve Reliability

Molex technical power experts will discuss three separate technologies that apply to power distribution, and how these solutions are reducing failures and improving reliability in the field.

1. Power-application customers face the tasks of choosing headers with exposed terminals that could leave connectors susceptible to damage, and large, fully isolated headers that take up too much space. We will discuss how innovative power connectors help solve this dilemma by providing design engineers with fully protected header terminals in a small package. Topics covered include a technology overview and applications.

2. When mating two rigid PCBs or bus bars, it is difficult to have perfect pin-to-socket alignment. A degree of float is needed in these situations to accommodate any misalignment there may be. A new interconnect system provides up to 1.0mm of float (industry leading) through its unique design. This float assures ease of mating and prevents potential damage to the socket contacts.

3. We will review laminated busbar applications and how of custom power distribution solutions can be utilized.


Trent Perkins, Group Product Manager, Molex
Jeff Gaumer, New Product Development Manager, Molex
Ralph Kern, Business Development Manager – Triton

How Unique Cable & Connector Solutions Are Taking 3D Printing to New Levels

In today's fast paced, quick development cycle market-places, the need for rapid prototyping and quick turn sampling is critical. 3D printing, and additive manufacturing has quickly surfaced as the solution for this need, bringing to life ideas and concepts in minutes, instead of months. Tyler Madden, Global Product Manager for Data and Devices at TE Connectivity, will discuss how Heilind Electronics and TE Connectivity's cable and connector systems can enable 3D printing, as we dive into product based solutions that can enable your 3D printer designs.

In the second half of this webinar, we will take a closer look at challenges faced today and how TE's discrete wire interconnect solutions consisting of CT, Mini CT and HPI can help. We will also review new innovative products that can provide space savings, and unique cable routing solutions, to take your designs to new levels!

Tyler Madden, Global Product Manager - Data & Devices Business Unit, TE Connectivity