1-331677-4

Heilind Number:AMP1-331677-4
Manufacturer:TE Connectivity
Manufacturer Number:1-331677-4
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SOCKET,MIN-SPR AU SER-3

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-331677-4
Series:Series 4
Amperage:6.5 A
Termination Method:Through Hole - Press-Fit
Contact Material:Beryllium Copper
Contact Type:Socket
Socket Type:Discrete
Hole Size:.062 in, 1.57 mm
Cable Type:Discrete Wire
Contact Amperage:6.5 A
Profile:Zero
Operating Temperature Range:-65 - 125 °C, -85 - 257 °F
Circuit Application:Power & Signal
PCB Thickness (Recommended):.031 - .125 in, .79 - 3.18 mm
Sealable:No
Connector and Contact Terminate To:Printed Circuit Board
Wire Size:20 - 21 AWG, .41 - .518 mm²
Contact Transmits:Signal/Power
Pin Diameter Accepted:.03 - .033 in, .76 - .84 mm
Connector System:Cable-to-Board
Spring Material:Beryllium Copper
Socket Length:.138 in, 3.51 mm
Sleeve Material:Copper
Sleeve Plating:Gold Flash over Nickel
Sealant:No
Contact Spring Plating Material:Gold
Sleeve Style:Closed Bottom
Insertion Method:Hand/Semi-Automatic/Automatic
Part Aliases:1-331677-4
SKU:AMP1-331677-4

Detailed Description

Introducing our SOCKET,MIN-SPR AU SER-3 from the Series 4 lineup, designed for efficient power and signal transmission in electronic circuits. This beryllium copper contact type socket features a through-hole press-fit termination method, ensuring secure and reliable connections. With a current rating of 6.5 A, it is suitable for various applications. The socket's compact profile and closed bottom sleeve design make it ideal for space-constrained environments, while its gold-plated contacts guarantee excellent conductivity. Operating within a wide temperature range, from -65 to 125°C (-85 to 257°F), this socket is highly durable. Its compliance with RoHS regulations further underscores its quality and reliability. Perfect for use in Cable-to-Board connector systems, this socket is a versatile solution for your connectivity needs.