1-5353135-0

AMP1-5353135-0
Heilind Number:AMP1-5353135-0
Manufacturer:TE Connectivity
Manufacturer Number:1-5353135-0
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

.6FHP08H,280,B,STD,08/Sn,TR,NSYes

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Specifications

AttributeValue
Product Category:
Board To Board PCB Connectors Mezzanine & Board Stacking Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-5353135-0
Housing Material:High Temperature Thermoplastic
Number of Rows:2
Mount Type:Board Mount
Termination Method:Surface Mount
Contact Material:Copper Alloy
Pitch:.024 in, 6 mm
Voltage:50 V AC
Contact Type:Pin
Contact Amperage:.5 A
Number of Positions:280
Housing Color:Black
Mount Orientation:Vertical
Insulation Resistance:2 MΩ
Operating Temperature Range:-40 - 185 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.2 µm, 7.874 µin
PCB Retention:With
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):.2 in
Connector Height:.314 in, 8 mm
PCB Retention Type:Solder Peg
Ground Component Type:Grounding Contact, Grounding Plate
Mating Alignment:With
Mating Alignment Type:Polarization
Connector and Contact Terminate To:Printed Circuit Board
Contact Layout:Inline
Connector System:Board to Board
Stackable:Yes
Dielectric Withstanding Voltage:200 V AC
Board to Board Configuration:Mezzanine
PCB Mount Alignment:With
PCB Mount Alignment Type:Locating Posts
Application Assembly Feature:Vacuum Cover
Connector Assembly Type:PCB Mount Header
Stack Height:16 mm, .63 in, 8 mm
PCB Contact Termination Area Plating Thickness:1 µm, 39.37 µin
Contact Mating Area Length:1.3 mm, 1 mm
Material Flammability Standard:UL 94V-0
Part Aliases:1-5353135-0
SKU:AMP1-5353135-0

Detailed Description

Enhance PCB connectivity with this high-quality Board to Board Mezzanine Connector. Featuring a compact design with two rows and a .6mm pitch, it ensures efficient signal transmission and power delivery. The housing, made of UL 94V-0-rated High Temperature Thermoplastic in sleek black, guarantees durability in harsh environments. With a contact layout of Inline and a stackable configuration, it offers versatility in assembly. Its surface mount termination method and solder peg PCB retention type provide secure attachment. The gold-plated copper alloy contacts ensure reliable conductivity, meeting stringent performance standards. Ideal for data and device applications, this connector is a crucial component for seamless board-to-board connections.