| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1-767032-9 |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Pitch: | .025 in, .64 mm |
| Voltage: | 30 V AC, 5 V DC |
| Contact Type: | Pin |
| Row Spacing: | .228 in, 5.79 mm |
| Impedance: | 50 Ω |
| Contact Amperage: | 11.5 A |
| Number of Positions: | 190 |
| Data Rate: | 10 Gb/s |
| Housing Color: | Black |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 2 MΩ |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | With |
| PCB Contact Termination Area Plating: | Tin-Lead |
| PCB Thickness (Recommended): | 1.57 mm, .8 in |
| Connector Height: | 19.812 mm, .78 in |
| PCB Retention Type: | Boardlock |
| Sealable: | No |
| Ground Component Type: | Ground Bus |
| Mating Alignment: | Without |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Columns: | 95 |
| Number of Power Positions: | 5 |
| Number of Signal Positions: | 190 |
| Contact Layout: | Inline |
| Connector Length: | 3 in, 76.2 mm |
| Connector System: | Board to Board |
| Stackable: | No |
| Board to Board Configuration: | Mezzanine |
| Contact Shape: | Dual Beam |
| Connector Width: | .32 in, 8.128 mm |
| Mating Retention: | With |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Boardlock, Locating Posts |
| Application Assembly Feature: | None |
| Differential Signaling: | Yes |
| Header Type: | Header Only |
| Connector Assembly Type: | PCB Mount Header |
| Stack Height: | 1.143 in, 20 mm, 29 mm |
| PCB Contact Termination Area Plating Thickness: | 150 - 250 µin |
| Standards Met: | CSA |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 1-767032-9 |
| SKU: | AMP1-767032-9 |
1-767032-9
| Heilind Number: | AMP1-767032-9 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 1-767032-9 |
| Datasheet: | Product Specification |
| ECAD Model: | |
Specifications
Detailed Description
Enhance your signal connectivity with the MICT,788PLUG,190,ASSY,.025,REC board-to-board connector. Designed for high-speed data transmission at 10 Gb/s, this vertical-mount connector features 190 signal positions in a dual-row layout, ensuring reliable performance in demanding applications. With a contact impedance of 50 Ω and a contact amperage of 11.5 A, it meets CSA and UL standards for safety and quality. The housing, made of LCP, offers exceptional durability with a flammability rating of UL 94V-0. Gold plating on the contact mating area guarantees efficient power transfer, while the tin-lead plating on the PCB contacts ensures secure mounting on boards with a thickness of 1.57 mm. Operating in a wide temperature range from -67 to 257 °F, this connector is suitable for various environments. Its innovative dual-beam contact shape and differential signaling capability make it ideal for data and devices applications. The connector is RoHS compliant, providing peace of mind for environmentally conscious projects. Whether you're assembling complex circuitry or optimizing signal paths, this high-performance connector is the perfect choice for your connectivity needs.
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Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |