1-767096-3

Heilind Number:AMP1-767096-3
Manufacturer:TE Connectivity
Manufacturer Number:1-767096-3
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

MICT,REC,228,ASY,.025,TAPE,CAP

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-767096-3
Housing Material:Liquid Crystal Polymer
Number of Rows:2
Mount Type:Board Mount
Termination Method:Surface Mount
Contact Material:Copper Alloy
Pitch:24.003 mm, .64 mm, .945 in
Voltage:30 V AC, 6 V DC
Contact Type:Socket
Row Spacing:.228 in, 5.79 mm
Impedance:50 Ω
Contact Amperage:11.5 A
Number of Positions:228
Data Rate:10 Gb/s
Housing Color:Black
Mount Orientation:Vertical
Insulation Resistance:2 MΩ
Mating Entry Location:Bottom
Operating Temperature Range:-67 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold or Palladium Nickel or Performance Based
Contact Mating Area Plating Thickness:30 µin, .76 µm
PCB Retention:With
PCB Contact Termination Area Plating:Tin-Lead
PCB Thickness (Recommended):1.57 mm, .8 in
Connector Height:.24 in, 6.096 mm
Sealable:No
Ground Component Type:Ground Bus
Mating Alignment:With
Connector and Contact Terminate To:Printed Circuit Board
Number of Columns:114
Number of Power Positions:6
Number of Signal Positions:228
Contact Layout:Inline
Connector Length:3.5 in, 88.9 mm
Connector System:Board to Board
Stackable:No
Board to Board Configuration:Mezzanine
Contact Shape:Dual Beam
Connector Width:.272 in, 6.9 mm
Mating Retention:With
PCB Mount Alignment:With
PCB Mount Alignment Type:Locating Posts
Application Assembly Feature:Pick and Place Cover
Differential Signaling:Yes
Header Type:Header Only
Connector Assembly Type:PCB Mount Receptacle
Stack Height:10.92 mm, 12.57 mm, 17.96 mm, 18.75 mm, 20 mm, 22.86 mm, 6.6 mm, .9 in, 9 mm
PCB Contact Termination Area Plating Thickness:150 - 250 µin
Standards Met:CSA
Material Flammability Standard:UL 94V-0
Part Aliases:1-767096-3
SKU:AMP1-767096-3

Detailed Description

Enhance your signal connectivity with this meticulously engineered MICT receptacle assembly, featuring 228 inline contact positions for seamless board-to-board mating. Crafted with a liquid crystal polymer housing in sleek black, it ensures durability and performance in demanding environments. With a pitch of .64mm and impedance of 50Ω, this connector supports high-speed data transmission at 10 Gb/s. The surface mount termination method and PCB retention capability with tin-lead plating guarantee secure and reliable attachment. Meeting CSA and UL standards for quality and safety, it operates effectively in a wide temperature range from -67 to 257°F. The dual-beam contact shape and gold/palladium nickel plating in the mating area optimize conductivity, while the ground bus component type offers stability. Designed for vertical mount orientation, this header-only connector with a 3.5-inch length and .272-inch width is ideal for mezzanine and board stacking configurations. Whether in data and device applications or signal circuitry, this assembly provides efficient and consistent performance.