1-767114-2

Heilind Number:AMP1-767114-2
Manufacturer:TE Connectivity
Manufacturer Number:1-767114-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

MICT,REC,190,ASY,.025,TAPE PKG

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-767114-2
Housing Material:Liquid crystal polymer(LCP)
Number of Rows:2
Mount Type:Board Mount
Termination Method:Surface Mount
Contact Material:Copper Alloy
Pitch:24.003 mm, .64 mm, .945 in
Voltage:30 V AC, 5 V DC
Contact Type:Socket
Row Spacing:.228 in, 5.79 mm
Impedance:50 Ω
Contact Amperage:11.5 A
Number of Positions:190
Data Rate:10 Gb/s
Housing Color:Black
Mount Orientation:Vertical
Insulation Resistance:2 MΩ
Mating Entry Location:Bottom
Operating Temperature Range:-67 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold or Palladium Nickel or Performance Based
Contact Mating Area Plating Thickness:30 µin, .76 µm
PCB Retention:With
PCB Contact Termination Area Plating:Tin-Lead
PCB Thickness (Recommended):1.57 mm, .8 in
Connector Height:.24 in, 6.096 mm
Sealable:No
Ground Component Type:Ground Bus
Mating Alignment:With
Connector and Contact Terminate To:Printed Circuit Board
Number of Columns:95
Number of Power Positions:5
Number of Signal Positions:190
Contact Layout:Inline
Connector Length:3 in, 76.2 mm
Connector System:Board to Board
Stackable:No
Board to Board Configuration:Mezzanine
Contact Shape:Dual Beam
Connector Width:.272 in, 6.9 mm
Mating Retention:With
PCB Mount Alignment:With
PCB Mount Alignment Type:Locating Posts
Differential Signaling:Yes
Header Type:Header Only
Connector Assembly Type:PCB Mount Receptacle
Stack Height:10.92 mm, 12.57 mm, 17.96 mm, 18.75 mm, 20 mm, 22.86 mm, 6.6 mm, .9 in, 9 mm
PCB Contact Termination Area Plating Thickness:150 - 250 µin
Standards Met:CSA
Material Flammability Standard:UL 94V-0
Part Aliases:1-767114-2
SKU:AMP1-767114-2

Detailed Description

Enhance your circuit connections with this cutting-edge MICT board-to-board connector, meticulously designed for high-performance applications. Featuring dual-beam contact shapes and a 190-position layout, it ensures reliable signal transmission at an impressive data rate of 10 Gb/s. With housing crafted from UL 94V-0 rated liquid crystal polymer, it guarantees robustness and safety in operation. The gold or palladium nickel plating on the contact mating area offers optimal conductivity, while the tin-lead plating on the PCB contact terminals ensures secure attachment. Meeting stringent standards such as CSA and UL certifications, this connector is ideal for demanding environments. Its innovative design, including a vertical mount orientation and mezzanine board-to-board configuration, enables seamless integration into your electronic systems. Whether used in industrial machinery or telecommunications equipment, its 30 V AC and 5 V DC voltage ratings, along with an impedance of 50 Ω, make it versatile for various applications. Trust in the reliability and performance of this MICT board-to-board connector for your connectivity needs.