1-767127-1

Heilind Number:	AMP1-767127-1
Manufacturer:	TE Connectivity
Manufacturer Number:	1-767127-1
Datasheet:	Datasheet
ECAD Model:

Description:

MICT,PLG,152,ASY,.025,TAPE PKG

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Specifications

Attribute	Value
Product Category:	Board To Board PCB Connectors Mezzanine & Board Stacking Connectors
Manufacturer:	TE Connectivity
Manufacturer Part Number:	TE Connectivity 1-767127-1
Housing Material:	Liquid crystal polymer(LCP)
Number of Rows:	2
Mount Type:	Board Mount
Termination Method:	Surface Mount
Contact Material:	Copper Alloy
Pitch:	24.003 mm, .64 mm, .945 in
Voltage:	30 V AC
Contact Type:	Pin
Row Spacing:	.228 in, 5.79 mm
Impedance:	50 Ω
Contact Amperage:	11.5 A
Number of Positions:	152
Data Rate:	10 Gb/s
Housing Color:	Black
Mount Orientation:	Vertical
Insulation Resistance:	2 MΩ
Operating Temperature Range:	-67 - 257 °F
Circuit Application:	Signal
Contact Mating Area Plating:	Gold or Palladium Nickel or Performance Based
Contact Mating Area Plating Thickness:	30 µin, .76 µm
PCB Retention:	With
PCB Contact Termination Area Plating:	Tin-Lead
PCB Thickness (Recommended):	1.57 mm, .8 in
Connector Height:	12.446 mm, .49 in
Sealable:	No
Ground Component Type:	Ground Bus
Mating Alignment:	Without
Connector and Contact Terminate To:	Printed Circuit Board
Number of Columns:	76
Number of Power Positions:	4
Number of Signal Positions:	152
Contact Layout:	Inline
Connector Length:	2.498 in, 63.45 mm
Connector System:	Board to Board
Stackable:	No
Board to Board Configuration:	Mezzanine
Contact Shape:	Dual Beam
Connector Width:	.208 in, 5.2832 mm
Mating Retention:	With
PCB Mount Alignment:	With
PCB Mount Alignment Type:	Locating Posts
Differential Signaling:	Yes
Header Type:	Header Only
Connector Assembly Type:	PCB Mount Header
Stack Height:	12.57 mm, 21.6 mm, .85 in
PCB Contact Termination Area Plating Thickness:	150 - 250 µin
Standards Met:	CSA
Material Flammability Standard:	UL 94V-0
Part Aliases:	1-767127-1
SKU:	AMP1-767127-1

Detailed Description

Enhance your circuit connections with this high-performance MICT Plug Assembly, offering a total of 152 contact positions in a compact design. With a pitch of .64mm, this connector ensures precise and reliable board-to-board mounting. Its Liquid Crystal Polymer housing guarantees durability, while the contact material of Copper Alloy with gold or palladium plating ensures optimal conductivity. Meeting CSA and UL standards, this assembly is suitable for a wide range of applications, with an operating temperature range from -67 to 257°F. Whether for signal transmission or power distribution, its dual-beam contact shape and inline layout provide efficient performance, supporting data rates up to 10 Gb/s. With PCB retention and mating alignment features, installation is secure and straightforward. RoHS compliance may vary, making it a versatile choice for your connectivity needs.