| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1-767127-2 |
| Housing Material: | Liquid crystal polymer(LCP) |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Pitch: | 24.003 mm, .64 mm, .945 in |
| Voltage: | 30 V AC, 5 V DC |
| Contact Type: | Pin |
| Row Spacing: | .228 in, 5.79 mm |
| Impedance: | 50 Ω |
| Contact Amperage: | 11.5 A |
| Number of Positions: | 190 |
| Data Rate: | 10 Gb/s |
| Housing Color: | Black |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 2 MΩ |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold or Palladium Nickel or Performance Based |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | With |
| PCB Contact Termination Area Plating: | Tin-Lead |
| PCB Thickness (Recommended): | 1.57 mm, .8 in |
| Connector Height: | 12.446 mm, .49 in |
| Sealable: | No |
| Ground Component Type: | Ground Bus |
| Mating Alignment: | Without |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Columns: | 95 |
| Number of Power Positions: | 5 |
| Number of Signal Positions: | 190 |
| Contact Layout: | Inline |
| Connector Length: | 3 in, 76.2 mm |
| Connector System: | Board to Board |
| Stackable: | No |
| Board to Board Configuration: | Mezzanine |
| Contact Shape: | Dual Beam |
| Connector Width: | .208 in, 5.2832 mm |
| Mating Retention: | With |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Differential Signaling: | Yes |
| Header Type: | Header Only |
| Connector Assembly Type: | PCB Mount Header |
| Stack Height: | 12.57 mm, 21.6 mm, .85 in |
| PCB Contact Termination Area Plating Thickness: | 150 - 250 µin |
| Standards Met: | CSA |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 1-767127-2 |
| SKU: | AMP1-767127-2 |
1-767127-2
Specifications
Detailed Description
Enhance your PCB connectivity with our high-performance Mezzanine & Board Stacking Connector. Designed for optimal signal transmission, this connector features a dual-beam contact shape and inline layout, accommodating 190 signal positions and five power positions with a contact layout of 95 columns. With a pitch of 0.64mm, it offers precise board-to-board configuration for seamless integration. Certified to meet CSA and UL standards, the connector ensures reliability in demanding environments, with a housing made of flame-retardant LCP. Operating efficiently in temperatures ranging from -67 to 257°F, it guarantees consistent performance. The surface-mount termination method and gold or palladium nickel plating on the contact mating area facilitate easy installation and enhance conductivity, while the differential signaling capability allows for high-speed data transmission at 10Gb/s. Whether for data centers or industrial applications, this connector, with its compact design and vertical mount orientation, is the ideal solution for your connectivity needs.

