| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1410326-3 |
| Series: | MULTIGIG RT 2 |
| Amperage: | 1 A |
| Connector Type: | Daughtercard (Plug) |
| Gender: | Plug |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Copper |
| Pitch: | .07 in, 1.8 mm |
| Voltage: | 50 VDC |
| Contact Type: | Pin |
| Contact Length: | 28.68 mm, 2.9 mm, .8 in |
| Row Spacing: | .053 in, 1.35 mm |
| Impedance: | 100 Ω |
| PCB Hole Diameter: | .018 in, .46 mm |
| Number of Pairs: | 20 |
| Number of Positions: | 112 |
| Data Rate: | 12.5 Gb/s, ≤12 Gb/s |
| Housing Color: | Black |
| Mount Orientation: | Right Angle |
| Termination Type: | Not Specified |
| Module Type: | Center |
| Tail Length: | .055 in, 1.4 mm |
| Operating Temperature Range: | -55 - 105 °C, -67 - 221 °F |
| Circuit Application: | Power & Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 1.27 µm, 50 µin |
| PCB Retention: | With |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin-Lead |
| PCB Thickness (Recommended): | .062 - .157 in, 1.6 - 4 mm |
| Connector Height: | 18.4 mm, .724 in |
| PCB Retention Type: | Action/Compliant Pin |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Guide Slot |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Columns: | 16 |
| Contact Layout: | Inline |
| Connector Length: | 1.129 in |
| Connector System: | Board to Board |
| Contact Termination Plating: | Tin-Lead |
| Connector Product Type: | Daughtercard Connector |
| Pairs Per Column: | 2 |
| Contact Style: | Feed Through |
| Board to Board Configuration: | Right Angle |
| Contact Underplating Thickness: | 1.27 µm, 50 µin |
| PCB Contact Termination Area Plating Finish: | Bright |
| Mating Retention: | With |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Action/Compliant Tail |
| Make First / Break Last: | Yes |
| Termination Post Length: | .055 in, 1.41 mm |
| Shroud Type: | Fully |
| Post Type: | Through Hole - Press-Fit |
| Type: | With |
| PCB Contact Termination Area Plating Thickness: | 1.27 µm, 50 µin |
| Card Slot Centerline: | 20.3 mm, .8 in |
| Guide Location: | Right |
| Number of Ground Positions: | 31 |
| Guide Hardware: | With |
| Durability Rating (Cycles): | 500 Cycles |
| Part Aliases: | 1410326-3 |
| SKU: | AMP1410326-3 |
1410326-3
Specifications
Detailed Description
Enhance your connectivity with the MULTIGIG RT T2 7RW DC DF CT Daughtercard Connector from our MULTIGIG RT 2 series. Featuring a sleek black LCP housing, this board mount connector with 112 positions is designed for power and signal applications in demanding environments. With a contact impedance of 100 Ω and a data rate of up to 12.5 Gb/s, it ensures reliable performance. The right-angle mount orientation and guide slot mating alignment facilitate easy installation. Gold-plated contact mating areas and a durable design, compliant with RoHS standards, guarantee longevity and environmental responsibility. Perfect for aerospace, defense, and marine industries, this connector is a versatile solution for your connectivity needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download | |||
| 10/15/2025 | P-25-029003 - New manufacturing facility. Outside vendor currently producing the metal Alignment pins used in Multigig Daughtercard assemblies is moving manufacturing to a new facility. Facility is in same general area as existing plant in USA. | Download | |||
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download | |||
Availability
In Stock:
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Stock Location:
In Stock
Factory Stock:
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Factory Lead:
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Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |