1648318-2

Heilind Number:AMP1648318-2
Manufacturer:TE Connectivity
Manufacturer Number:1648318-2
Datasheet:3D Drawing
ECAD Model:
3D Model

Description:

702-32-01109=CONTACT,SKT,#12

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1648318-2
Mount Type:Crimp
Contact Material:Copper Alloy
Contact Type:Socket
Contact Amperage:25 A
Termination Type:Crimp
GPL:G65
Packaging:Bag
Operating Temperature Range:-40 - 105 °C, -40 - 221 °F
Circuit Application:Power
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:10 µin, .254 µm
Contact Termination Plating Thickness:10 µin, .254 µm
Contact Underplating Material:Nickel
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Wire & Cable
Product Code:H848
Wire Size:12 - 14 AWG, 2.081 - 3.301 mm²
Contact Termination Plating:Gold
ECCN:EAR99
Contact Underplating Thickness:1.27 µm, 50 µin
Wire Insulation Support:Without
Contact Retention:Without
Contact Orientation:Straight
Wire Contact Termination Area Plating Material:Gold
Crimp Area Plating Finish:Gold
Crimp Area Plating Thickness:10 µin, .25 µm, 30 µin
Contact Product Type:Contact
Mating Pin Diameter:.094 in, 2.39 mm
Part Aliases:702-32-01109 1648318-2
SKU:AMP1648318-2

Detailed Description

Enhance your power connections with our high-performance Crimp Socket Contact, designed for seamless integration in various applications. Crafted from durable Copper Alloy with a Gold-plated finish, it ensures reliable conductivity, even in demanding environments. With a contact amperage of 25 A and a wire size compatibility of 12-14 AWG, it guarantees efficient power transmission. Operating flawlessly in temperatures ranging from -40 to 105 °C (-40 to 221 °F), this contact is a versatile solution for power circuit applications. Its straight orientation and crimp termination make installation a breeze, while its RoHS compliance underscores our commitment to environmental responsibility. Upgrade your connectivity with this essential component from our Data and Devices collection.