1775060-1

Heilind Number:AMP1775060-1
Manufacturer:TE Connectivity
Manufacturer Number:1775060-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

MINI USB, TYPE B, VERTICAL, T/H

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1775060-1
Gender:Receptacle
Housing Material:Polybutylene Terephthalate
Mount Type:Board Mount
Termination Method:Wave Solder
Pitch:.031 in, 8 mm
Shell Plating:Tin over Copper
Number of Ports:1
Orientation:Vertical
USB Type:B
USB Size:Mini
Mount Location:Top
Contact Amperage:1 A
Number of Positions:5
Housing Color:Black
Termination Type:Through Hole
Tail Length:.047 in, 1.2 mm
Operating Temperature Range:-20 - 60 °C, -4 - 140 °F
Circuit Application:Power & Signal
Contact Mating Area Plating:Gold Flash over Palladium Nickel
Contact Mating Area Plating Thickness:29.92 µin, .76 µm
Mating Cycles:5000
PCB Thickness (Recommended):.8 mm
PCB Retention Type:Straight Leg
Connector and Contact Terminate To:Printed Circuit Board
Connector System:Cable-to-Board
Connector Product Type:Connector
LED Indicator:Without
Offset:0 mm
Shell Plating Finish:Bright
Locating Posts:Without
Maximum Soldering Temperature:240 °C, 464 °F
Locking Latch:Without
Halogen Free:No
Locking Feature:With
PCB Connector Seating:Flush
Standard:USB 2.0
Material Flammability Standard:UL 94V-0
Part Aliases:1775060-1
SKU:AMP1775060-1

Detailed Description

Enhance your connectivity with our Mini USB Type B Receptacle, designed for seamless board mounting through wave soldering. Featuring a vertical orientation and a durable Polybutylene Terephthalate housing in sleek black, this connector is UL 94V-0 compliant for optimal safety. With a high-speed USB 2.0 interface, it supports power and signal transmission with a contact amperage of 1A. The gold flash over palladium nickel plating ensures reliable performance over 5000 mating cycles, while the straight leg PCB retention type offers secure attachment. RoHS compliant and packaged in trays of 150, this connector is ideal for various applications in data and device connectivity.