| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 179097-1 |
| Color: | White |
| Series: | Multilock Connector System |
| Number of Rows: | 2 |
| Termination Method: | Through Hole - Solder |
| Maximum Operating Temperature: | 100 °C, 105 °C, 149 °F, 158 °F, 167 °F, 176 °F, 185 °F, 194 °F, 212 °F, 221 °F, 65 °C, 70 °C, 75 °C, 80 °C, 85 °C, 90 °C |
| Pitch: | .138 in, 3.5 mm |
| Package Quantity: | 70 |
| Number of Positions: | 12 |
| Mount Orientation: | Horizontal/90° |
| GPL: | N20 |
| Operating Temperature Range: | -22 - 221 °F, -30 - 105 °C |
| Panel Mount: | Without |
| Shielded: | No |
| PCB Retention: | With |
| PCB Thickness (Recommended): | .063 in, 1.6 mm |
| PCB Retention Type: | Mounting Hole |
| Sealable: | No |
| GPL Description: | Automotive |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | M181 |
| Connector Width: | 1.29 in, 32.7 mm |
| PCB Mount Alignment: | Without |
| Length: | 25.02 mm, .985 in |
| Locking Interface: | Without |
| Interface Plating: | Tin |
| Mounting Holes: | Without |
| Packaging Type: | Tube |
| Hybrid Header: | No |
| Part Aliases: | 179097-1 |
| SKU: | AMP179097-1 |
179097-1
Specifications
Detailed Description
The MULTI LOCK I/O CAP ASSY 12P in White is an essential component for your automotive connectivity needs. Featuring a two-row design with 12 positions, this connector ensures secure and reliable connections. With a through-hole solder termination method and a pitch of 3.5mm, it offers easy installation on your PCB with a thickness of 1.6mm. Operating efficiently in temperatures ranging from -30 to 105°C, it is suitable for a variety of automotive applications. Its durable construction and wave solder capability make it a dependable choice for your assembly process. With a compact size and horizontal/90° mount orientation, it allows for flexible integration into your design. Trust in this connector for high-performance connectivity in automotive environments.

