1888174-6

Heilind Number:AMP1888174-6
Manufacturer:TE Connectivity
Manufacturer Number:1888174-6
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

Mini-SAS Rcpt Assy V w/ Shld T-H,36p

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1888174-6
Series:Mini-SAS
Amperage:.5 A
Connector Type:Mini-SAS
Gender:Receptacle
Number of Rows:2
Mount Type:Board Mount
Contact Material:Phosphor Bronze
Contact Plating:Gold
Maximum Operating Temperature:105 °C
Body Orientation:Straight
Pitch:.031 in, 8 mm
Number of Ports:1
Keying:Yes
Package Quantity:26
Key Type:2
Contact Amperage:.5 A
Number of Positions:36
Mount Orientation:Vertical
GPL:K53
Packaging:Box & Tube, Tube
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin
PCB Retention:Without
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:K846
Connector System:Cable-to-Board
Stackable:No
Connector Product Type:Connector
ECCN:EAR99
Termination Post Length:.138 in, 3.5 mm
PCB Mounting Style:Surface Mount
Receptacle Configuration:Mini-SAS
Shell:With
High Temperature Housing:Yes
Part Aliases:1888174-6
SKU:AMP1888174-6

Detailed Description

Enhance connectivity within your systems with our Mini-SAS Receptacle Assembly, designed for optimal performance in high-speed data transfer applications. Featuring a vertical mount orientation and a two-row configuration, this connector boasts 36 gold-plated contacts for reliable signal transmission. With a secure straight body orientation and a .8mm pitch, it ensures a precise fit on your PCB. Operating efficiently in temperatures ranging from -55 to 105°C, it meets the demands of diverse environments. RoHS compliant and crafted with high-temperature housing, this connector guarantees both performance and environmental responsibility. Upgrade your setup with this essential component for seamless data and device integration.