2-2170747-6

Heilind Number:AMP2-2170747-6
Manufacturer:TE Connectivity
Manufacturer Number:2-2170747-6
Datasheet:Drawing
ECAD Model:
3D Model

Description:

CAGE ASSY, 1X4, QSFP28, SPRING, HS, LP

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2-2170747-6
Series:zQSFP+/QSFP28
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Number of Ports:4
Data Interface:QSFP28/56
Data Rate:28 Gb/s
Application:Standard
GPL:J25
Port Matrix Configuration:1 x 4
Tail Length:.081 in, 2.05 mm
Packaging:Box & Tray
Operating Temperature Range:-40 - 185 °F, -40 - 85 °C
Circuit Application:Signal
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):.062 in, 1.57 mm
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:X260
EMI and RFI Protection Type:Internal/External EMI Springs
Connector System:Cable-to-Board
Connector Product Type:Cage Assembly
ECCN:EAR99
Heat Sink Style:Pin
Cage Type:Ganged
Heat Sink Finish:Anodized Black
Heat Sink Height Class:Networking
Heat Sink Height:13.5 mm, .531 in
Lightpipe Configuraton:Dual Round
Cage Material:Nickel Silver
Lightpipe Included:Yes
Enhancements:Standard
Included Accessory:Heat Sink
Material Flammability Standard:UL 94V-0
Part Aliases:2-2170747-6
SKU:AMP2-2170747-6

Detailed Description

Enhance your networking capabilities with this high-speed Cage Assembly, featuring a 1 x 4 port matrix configuration for seamless connectivity. Designed for QSFP28/56 data interfaces, this assembly ensures reliable signal transmission at 28 Gb/s. Its durable construction, with UL 94V-0 flammability standard and nickel silver material, guarantees long-lasting performance in varied operating temperatures. With through-hole press-fit termination and included heat sink for optimal heat dissipation, this assembly is perfect for standard applications in demanding environments. The cable-to-board connector system, along with internal/external EMI springs, provides enhanced EMI and RFI protection. RoHS compliant and lead-free solder process capable, this assembly meets high-quality standards for data and device connections. Ideal for networking and telecommunications setups, it offers a seamless solution for your connectivity needs.