| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2-531803-0 |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 2 |
| Contact Material: | Brass |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | .05 in, 1.27 mm |
| Contact Type: | Pin |
| Row Spacing: | .15 in, 3.81 mm |
| Package Quantity: | 1 |
| Number of Positions: | 100 |
| Housing Color: | Gray |
| Mount Orientation: | Right Angle |
| GPL: | 090 |
| Packaging: | Package |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 50 µin |
| PCB Contact Termination Area Plating: | Tin-Lead |
| PCB Thickness (Recommended): | .054 - .07 in, 1.37 - 1.78 mm |
| Connector Height: | 13.2 mm, .52 in |
| Sealable: | No |
| GPL Description: | Aerospace Defense & Marine |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 5328 |
| Stackable: | No |
| Post Size: | .009 x .018 in, .23 x .46 mm |
| ECCN: | EAR99 |
| Application Assembly Feature: | None |
| Termination Post Tail Length: | .15 in, 3.81 mm |
| Header Type: | Shrouded |
| Connector Assembly Type: | PCB Mount Header |
| Part Aliases: | 2-531803-0 |
| SKU: | AMP2-531803-0 |
2-531803-0
Specifications
Detailed Description
Enhance your electronic connections with this MINI BX PIN HDR 100 POS. Boasting a sleek Right Angle design, it features a durable LCP housing in Gray, ideal for Aerospace Defense & Marine applications. With 100 Gold-plated brass contacts, this connector ensures reliable performance. Its 1.27mm pitch and PCB mount header assembly type make it perfect for board-to-board connections. The contact's Tin-Lead plating and 50µin gold mating area plating guarantee efficient signal transmission. Measuring at 13.2mm in height, it's suitable for compact spaces. Whether for industrial or commercial use, this connector offers a high-quality solution for your connectivity needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 08/24/2015 | E-14-016007 - Product Improvement. eliminate solder-ability test and therefore solder dipping operation. | Download | |||

