| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2-827235-0 |
| Housing Material: | Polybutylene Terephthalate - GV |
| Number of Rows: | 1 |
| Termination Method: | Through Hole - Solder |
| Contact Material: | CuZn |
| Pitch: | .3 in, 7.62 mm |
| Contact Type: | Pin |
| Number of Positions: | 20 |
| Mount Orientation: | Vertical |
| Contact Mating Area Plating: | Gold |
| Header Type: | Unshrouded |
| Product: | Board-to-Board Headers & Receptacles |
| SKU: | AMP2-827235-0 |
2-827235-0
| Heilind Number: | AMP2-827235-0 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 2-827235-0 |
| ECAD Model: | |
Specifications
Detailed Description
Easily connect your circuit boards with this 20-position board-to-board header. Crafted with durable Polybutylene Terephthalate housing and gold-plated copper contacts, it ensures reliable signal transmission. Featuring through-hole solder termination, installation is a breeze. The 7.62mm pitch and vertical mount orientation offer flexibility in PCB design. Ideal for stacking and mezzanine applications, this unshrouded header is a must-have for seamless board connectivity.
