2007818-1

Heilind Number:AMP2007818-1
Manufacturer:TE Connectivity
Manufacturer Number:2007818-1
Datasheet:Drawing
ECAD Model:
3D Model

Description:

IMP100S,H,V4P10C,UG,DEW46,4.5

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2007818-1
Series:IMPACT
Amperage:.75 A
Connector Type:Header
Gender:Plug
Housing Material:LCP - GF (Liquid Crystal Polymer)
Number of Rows:12
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Copper Alloy
Pitch:.075 in, 1.9 mm
Voltage:30 V AC, 30 V DC
Contact Type:Pin
Contact Length:.177 in, 21.7 mm, 4.5 mm
Row Spacing:.053 in, 1.35 mm
Impedance:100 Ω
PCB Hole Diameter:.018 in, .46 mm
Number of Pairs:40
Number of Positions:120
Data Rate:20 - 25 Gb/s
Housing Color:Black
Mount Orientation:Vertical
GPL:K74
Tail Length:.055 in, 1.4 mm
Packaging:Box & Tube, Package
Operating Temperature Range:-55 - 85 °C, -67 - 185 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:29.92 µin, .76 µm
PCB Retention:With
Contact Underplating Material:Nickel
PCB Thickness (Recommended):1 mm
Connector Height:11.95 mm, .47 in
PCB Retention Type:Action/Compliant Tail
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:L348
Number of Columns:10
Number of Signal Positions:80
Contact Design:Dual Beam
Contact Layout:Inline
Contact Transmits:Signal (Data)
Connector Length:.854 in
Connector System:Board to Board
UL Agency Certification:E28476
Contact Termination Plating:Tin
Stackable:No
Connector Product Type:Connector
Pairs Per Column:4
Contact Style:Press-Fit
Board to Board Configuration:Right Angle, Vertical
Contact Underplating Thickness:1.27 µm, 50 µin
PCB Contact Termination Area Plating Finish:Matte
Connector Width:20.8 mm, .819 in
Mating Retention:Without
Make First / Break Last:No
Stack Height:11.95 mm
Shroud Type:Fully
PCB Contact Termination Area Plating Thickness:30 - 60 µin, .76 - 1.52 µm
Guide Location:Unguided
Number of Ground Positions:40
End Wall Location:Dual
Guide Hardware:Without
Signal Arrangement:Differential
Material Flammability Standard:UL 94V-0
Part Aliases:2007818-1
SKU:AMP2007818-1

Detailed Description

Enhance your signal connectivity with the IMP100S Board to Board Connector, featuring a high-speed data transmission rate of 20 - 25 Gb/s. Designed for reliability in demanding environments, this connector boasts a dual-beam contact design and press-fit termination method for secure and efficient performance. With 120 positions, including 80 signal and 40 ground, it offers a comprehensive solution for your PCB interconnect needs. Certified for UL 94V-0 flammability standards and RoHS compliant, it prioritizes safety and environmental responsibility. Suitable for differential signaling, this connector is ideal for applications requiring high-speed data transfer. The black LCP - GF housing and gold-plated contacts ensure durability and signal integrity, while the vertical mount orientation allows for flexible PCB layout. From data centers to telecommunications infrastructure, the IMP100S is the perfect choice for your board-to-board connectivity requirements.