| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2102772-2 |
| Series: | MULTIGIG RT 2-R |
| Amperage: | 1 A |
| Gender: | Plug |
| Number of Contacts: | 56 |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Body Orientation: | Right Angle |
| Pitch: | .075 in, 1.9 mm |
| Row Spacing: | .053 mm, 1.35 in |
| Number of Positions: | 56 |
| Mount Orientation: | Right Angle |
| GPL: | B54 |
| Operating Temperature Range: | -55 - 105 °C, -67 - 221 °F |
| Circuit Application: | Power & Signal |
| Mating Alignment: | With |
| GPL Description: | Aerospace Defense & Marine |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | J543 |
| Number of Columns: | 8 |
| Connector System: | Board to Board |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | Fully |
| Guide Location: | Left |
| Part Aliases: | 2102772-2 |
| SKU: | AMP2102772-2 |
2102772-2
Specifications
Detailed Description
Easily connect power and signal lines with this Right Angle Plug Assembly. Featuring 56 gold-plated contacts arranged in 7 rows, it ensures reliable performance in high-density board-to-board configurations. Designed for Aerospace Defense & Marine applications, this connector is ideal for demanding environments. With a 1A amperage rating and operating temperature range of -55 to 105°C (-67 to 221°F), it offers durability and efficiency. Its fully shrouded design and 1.9mm pitch facilitate secure mounting on printed circuit boards. Suitable for MULTIGIG RT 2-R series, this component guarantees precision and quality in all your connectivity needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download | |||
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download | |||
| 07/01/2024 | P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process | Download | |||
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |