2102785-2

Heilind Number:AMP2102785-2
Manufacturer:TE Connectivity
Manufacturer Number:2102785-2
Datasheet:Drawing
ECAD Model:
3D Model

Description:

RIGID FLEX STACKING CONN(LEAD FREE)

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2102785-2
Number of Rows:7
Termination Method:Through Hole - Press-Fit
Contact Material:Phosphor Bronze
Pitch:.07 in, 1.8 mm
Row Spacing:.053 in, 1.35 mm
Impedance:100 Ω
Contact Amperage:1 A
Number of Positions:56
Data Rate:12 Gb/s
Mount Orientation:Vertical
GPL:B54
Profile:Low
Packaging:Pocket Tape
Operating Temperature Range:-67 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:20 - 100 µin, .5 µm
PCB Retention:With
Contact Underplating Material:Nickel
PCB Contact Termination Area Plating:Tin
PCB Retention Type:Action/Compliant Tail
Sealable:No
GPL Description:Aerospace Defense & Marine
Connector and Contact Terminate To:Flexible Printed Circuit (FPC), Printed Circuit Board
Product Code:F029
Number of Columns:8
Number of Signal Positions:56
Connector System:Board to Board
Stackable:No
Stacking Configuration:End to End
Dielectric Withstanding Voltage:500 V AC
Board to Board Configuration:Parallel
Contact Mating Area Plating Finish:Matte
Contact Underplating Thickness:1.27 µm, 50 µin
Termination Post Tail Length:.06 in, 1.53 mm
Differential Signaling:Yes
Connector Assembly Type:PCB Mount Header
Stack Height:.157 in, 4 mm
Part Aliases:2102785-2
SKU:AMP2102785-2

Detailed Description

Introducing a high-performance Rigid Flex Stacking Connector, ideal for demanding aerospace, defense, and marine applications. Designed for reliable signal transmission, this connector features a 1.8mm pitch and 100Ω impedance, supporting data rates up to 12 Gb/s. With 56 positions and a vertical mount orientation, it ensures efficient PCB connectivity. The phosphor bronze contact material, with tin plating, offers excellent conductivity while meeting stringent operating temperature requirements. Its low-profile design and pocket tape packaging make it versatile for various board-to-board configurations. RoHS compliance underscores its environmental responsibility, making it a top choice for cutting-edge electronic systems.